Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Julien Thiefain"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
High quality and reliability are paramount for automotive and other high grade commercial applications. The implementation of scan testing including stuck-at, transition, IDDQ, bridging and cell-aware patterns have all been targeted at reducing the n
Autor:
Wentao Qin, Rebecca Burgin, Gordy Grivna, Jim Steinwall, Scott Donaldson, J.P. Gambino, George Chang, Chuck Belisle, Lahcen Boukhanfra, Denise Barrientos, Dan Rogers, Julien Thiefain
Publikováno v:
Microelectronics Reliability. 120:114102
The resistance between an aluminum (Al) metal line and a tungsten (W) via increased after thermal stress. In the wafer processing, the post W chemical mechanical planarization (WCMP) cleaning left residual WO3 on the W plug. Since the resistivity of
Autor:
Scott Donaldson, Gordy Grivna, Wentao Qin, George Chang, Jim Steinwall, J.P. Gambino, Denise Barrientos, Julien Thiefain, Dan Rogers, Lahcen Boukhanfra
Publikováno v:
International Symposium for Testing and Failure Analysis.
Many semiconductor products are manufactured with mature technologies involving the uses of aluminum (Al) lines and tungsten (W) vias. High resistances of the vias were sometimes observed only after electrical or thermal stress. A layer of Ti oxide w
Autor:
ASM Interational
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip d
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center.