Výsledky vyhledávání - "Julien Bertheau"

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps

Publikováno v: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

In this paper full integration flow for a low temperature (150°C) and high throughput die to wafer bonding method is introduced for microbumps pitches down to $10 \mu \mathrm{m}$ . The impact of Co plating chemistry, Sn thickness, annealing temperat

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5cfeeb4cc427d4dab249085f66d02da8
https://doi.org/10.1109/ectc32696.2021.00183

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10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Autor: Ehsan Shafahian, Gerald Beyer, Inge De Preter, Carine Gerets, Eric Beyne, Fumihiro Inoue, Jaber Derakhshandeh, Giovanni Capuz, Julien Bertheau, Andy Miller, Fabrice Duval, Alain Phommahaxay, Pieter Bex, T. Webers, Geert Van der Plas, Stefaan Van Huylenbroeck, Lin Hou, Vladimir Cherman

Publikováno v: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

In this paper, spacer bumps concept is introduced to increase the process window for TCB, lower the sensitivity of electrical yield to bump height variation, maintain the gap between two dies and to prevent too much solder deformation for a test vehi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::65abb2efc3d3b50eedb9705562af5988
https://doi.org/10.1109/ectc32862.2020.00102

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Protective Layer for Collective Die to Wafer Hybrid Bonding

Autor: Yohei Kinoshita, Eric Beyne, Samuel Suhard, Fumihiro Inoue, Julien Bertheau, Alain Phommahaxay, Tetsuro Kinoshita, Takuya Ohashi

Publikováno v: 3DIC

Blade dicing compatible particle protective layer is investigated for feasibility study of collective Die-to- Wafer (D2W) direct bonding. Having the compatibility to blade dicing, the protective layer needs to be insoluble for de-ionized water (DIW),

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5aff4d6be0bc184fb91958fa02d6eb4a
https://doi.org/10.1109/3dic48104.2019.9058870

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Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift

Autor: Alice Guerrero, Tom Cochet, Arnita Podpod, Hariharan Arumugam, Koen Kennes, Qi Wu, Kim Yess, Erick Sleeckx, Kim Arnold, Julien Bertheau, Andy Miller, Gerald Beyer, Eric Beyne, Alain Phommahaxay, Pieter Bex, Kenneth June Rebibis, Xiao Liu

Publikováno v: 2019 International Wafer Level Packaging Conference (IWLPC).

Next-generation temporary bonding adhesive material is introduced into imec's high interconnect density flip chip on fan-out wafer-level package (FC FOWLP) concept [1], [2]. After molding on silicon substrates, an ultralow die shift with an average o

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a414a95c86ac2e4f1be7eb284d750225
https://doi.org/10.23919/iwlpc.2019.8914144

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Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 um interconnect pitch scaling

Publikováno v: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

In this paper a novel solder-based die-to-die or wafer-to-wafer interconnect approach is introduced. This technique allows for microbump interconnects with different diameters on a single die and allows for pitch scaling down to 5μm A metal damascen

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::023c4836b336797eba252150c2054bc7
https://doi.org/10.23919/empc44848.2019.8951856

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Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up

Autor: Erik Sleeckx, Andy Miller, Pieter Bex, Arnita Podpod, Alain Phommahaxay, Alice Guerrero, John Slabbekoorn, Kim Yess, Abdellah Salahoueldhadj, Kim Arnold, Eric Beyne, G. Beyer, Julien Bertheau

Publikováno v: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

As the need for higher degrees of function integration on chips continues to rise, chip-to-chip connection density exponentially increases. The continuous push for denser interconnects has brought conventional FO-WLP to its limit. A novel FO-WLP conc

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b6c787fc0dbf692ab0910773a997edda
https://doi.org/10.1109/ectc.2019.00059

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Extreme Thinned-Wafer Bonding Using Low Temperature Curable Polyimide for Advanced Wafer Level Integrations

Autor: Erik Sleeckx, Serena Iacovo, Fumihiro Inoue, Lan Peng, Gerald Beyer, Alain Phommahaxay, Atsushi Nakamura, Kenneth Rebibs, Nouredine Rassoul, Eric Beyne, Julien Bertheau, Andy Miller

Publikováno v: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Extreme thinned wafer transfer technologies have been demonstrated by combining a selected set of temporary and permanent bonding materials. The extreme thinning was performed on the backside of a top wafer bonded on carrier wafer with the temporary

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::339f58818ac104ab942e750b5a876a93
https://doi.org/10.1109/ectc.2018.00021

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A Unique Temporary Bond Solution Based on a Polymeric Material Tacky at Room Temperature and Highly Thermally Resistant Application Extension from 3D-SIC to FO-WLP

Autor: Teng Wang, Gerald Beyer, Fabrice Duval, Arnita Podpod, Goedele Potoms, Julien Bertheau, Yoshitaka Kamochi, Greet Verbinnen, Pieter Bex, Erik Sleeckx, Atsushi Nakamura, Alain Phommahaxay, Eric Beyne

Publikováno v: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Among the technological developments pushed by the adoption of Through Silicon Vias and 3D Stacked IC technologies, wafer thinning on a temporary carrier has become a critical element in device processing over the past years. First generation of adhe

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::67cea930aea33b742b6d28f4b51afeba
https://doi.org/10.1109/ectc.2017.50

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3D IC assembly using thermal compression bonding and wafer-level underfill — Strategies for quality improvement and throughput enhancement

Autor: Fabrice Duval, Pieter Bex, Giovanni Capuz, Kenneth June Rebibis, Teng Wang, Keiichi Hatakeyama, Masanori Natsukawa, Julien Bertheau, Andy Miller, Fumihiro Inoue, Carine Gerets, Eric Beyne, Gerald Beyer, Kazuyuki Mitsukura

Publikováno v: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

This paper examines the key aspects for quality improvement and throughput enhancement of thermal compression bonding (TCB) process using dry film laminated wafer-level underfill (WLUF) material. The WLUF material must have good compatibility with pr

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b16e734717a00b6f54f30405eb684484
https://doi.org/10.1109/eptc.2016.7861589

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