Zobrazeno 1 - 2
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pro vyhledávání: '"Julian Hesselbach"'
Publikováno v:
Materials, Vol 17, Iss 2, p 280 (2024)
The effect of carbon-based additives on adhesives and potting compounds with regard to electrical conductivity and electromagnetic interference (EMI) shielding properties is of great interest. The increasing power of wireless systems and the ever-hig
Externí odkaz:
https://doaj.org/article/a281f5c4c2744259a4fc71d1e72c463c
Autor:
Lukas Orf, Eduard Kraus, Martin Bastian, Julian Hesselbach, Heinrich Leicht, Benjamin Baudrit, Hemanth Vudugula, Thomas Hochrein
Publikováno v:
The Journal of Adhesion. 96:48-63
Tensile strength of adhesive bonds with three different commercial epoxy resins and laser sintered polyamide 12 (PA 12) has been evaluated by means of Centrifugal Adhesion Testing Technolog...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac131f8a41ae8c5035b89d0a80231172
https://doi.org/10.1080/00218464.2019.1682561
https://doi.org/10.1080/00218464.2019.1682561