Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Julian Heidhoff"'
Publikováno v:
Fluids, Vol 7, Iss 3, p 119 (2022)
The microfluid jet polishing (MFJP) process is a manufacturing technology in which small abrasive particles (such as diamond, alumina, and ceria) are premixed with a carrier fluid (typically water) to form a liquid suspension that is pressurized and
Externí odkaz:
https://doaj.org/article/4237e0b507ec4ad5bb88fc01ff92ca5e
Autor:
Marius Herrmann, Björn Beckschwarte, Henning Hasselbruch, Julian Heidhoff, Christian Schenck, Oltmann Riemer, Andreas Mehner, Bernd Kuhfuss
Publikováno v:
Materials, Vol 13, Iss 21, p 4939 (2020)
Electromagnetic forming is a high-speed process, which features contactless force transmission. Hence, punching operations can be realized with a one-sided die and without a mechanical punch. As the forces act as body forces in the part near the surf
Externí odkaz:
https://doaj.org/article/93959d5df6804e288f3712c7595f4219
Autor:
Björn Beckschwarte, Julian Heidhoff, Lasse Langstädtler, Christian Schenck, Oltmann Riemer, Bernd Kuhfuss
Publikováno v:
Key Engineering Materials. 926:1725-1735
In electromagnetic embossing, the interaction of the magnetic field and the induced current density results in body forces that enable the replication of optical microstructures into thin sheet metals. However, as the sheet metal is completely penetr
Autor:
Ying Wang, Tianfeng Zhou, Oltmann Riemer, Julian Heidhoff, Min Li, Bernhard Karpuschewski, Stanislav N. Gorb, Clemens F. Schaber
Publikováno v:
Tribology International. 176:107708
Electromagnetic Embossing of Optical Microstructures with High Aspect Ratios in Thin Aluminum Sheets
Autor:
Christian Schenck, Björn Beckschwarte, Julian Heidhoff, Bernd Kuhfuss, Lars Schönemann, Marius Herrmann, Oltmann Riemer
Publikováno v:
ESAFORM 2021.
Electromagnetic embossing enables the transfer of surface structures from forming dies to metal sheets at high forming speeds. For this purpose, the contactless forming force is provided by means of a magnetic field of a tool coil which interacts wit