Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Julian Haberland"'
Autor:
Yunzhou Cheng, Christine Kallmayer, Niall McAlinden, Keith Mathieson, Julian Haberland, Martin D. Dawson, Erdan Gu, Christopher F. Reiche, Loren Rieth, Mehedy Hasan, Rohit Sharma, Prashant Tathireddy, Robert Scharf, Enyuan Xie, Steve Blair
Publikováno v:
Optogenetics and Optical Manipulation 2020.
Optogenetics is a powerful tool for neural control that supports perturbation of specific cell types. The Utah Optrode Array, paired with a µLED array, is an optical stimulation device for precise multi-site light delivery in deep cortical layers. W
Autor:
Andreas Ostmann, Christine Kallmayer, Manuel Seckel, Thomas Loher, Joao Marques, Julian Haberland, Malte von Krshiwoblozki
Publikováno v:
2019 IEEE CPMT Symposium Japan (ICSJ).
The ongoing miniaturization at different levels seems to be an constant in electronics development. It allows not only to increase in functionality in novel product generations, but also the spreading of electronics into new environments. In recent y
Autor:
Edgardo Anzures, Paul Morganelli, Robert Barr, Jeffrey Calvert, Avin Dhoble, David Fleming, Jong-Uk Kim, Herong Lei, Jürgen Grafe, Julian Haberland
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:001192-001221
As packaging technology continues to advance to smaller form factors, 3D chip stacking will become more of a requirement than an option and Non-Conductive Film (NCF) underfills will play a critical role in the assembly process. Capillary Underfills (
Autor:
Julian Haberland, Andre Schult, Christine Kallmayer, Fabian Kayatz, Florian Schaller, Thomas Loher
Publikováno v:
2018 13th International Congress Molded Interconnect Devices (MID).
3D conformable electronic systems have attracted considerable attention lately. New technologies to realize such 3D electronics not only save weight and volume in known applications - e.g. car interior. They also allow completely new functionalities
Autor:
Christine Kallmayer, Andreas Ostmann, Barbara Pahl, K.-F. Becker, Lars Böttcher, K-D. Lang, J. Bauer, Tanja Braun, Martin Schneider-Ramelow, Julian Haberland, Rolf Aschenbrenner
Publikováno v:
International Symposium on Microelectronics. 2011:000142-000151
Decreasing the bill of materials for an electronic device saves development time, money and space. The integration of more and more functions not only on the chip (SoC; system on chip) but also in the package (SiP; system in package) is therefore a n
Autor:
Daniel Janczak, Małgorzata Jakubowska, Grzegorz Wroblewski, Marcin Słoma, Joao Marques, Julian Haberland, Christine Kallmayer
Publikováno v:
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Autor:
Katja Heumann, Stephan Guttowski, Ivan Ndip, Christine Kallmayer, Christian Tschoban, Julian Haberland, Florian Ohnimus, Klaus-Dieter Lang
Publikováno v:
2010 Loughborough Antennas & Propagation Conference.
In this work, a small encapsulated planar dipole antenna is designed and characterized for an UHF RFID tag. In the envisaged application, the RFID tag is applied to the front or back ends of wood logs loaded on a truck for monitoring purposes in logi
Autor:
Julian Haberland, Christine Kallmayer
Publikováno v:
Frequenz. 58
The project "Autarkic Distributed Microsystems" is focused on the development of a miniaturized 3-dimensional package by using advanced assembly technologies up to wafer level assembly processes. In this connection the article points out the great po
Autor:
Rolf Aschenbrenner, Christine Kallmayer, S. Schmitz, Herbert Reichl, Julian Haberland, B. Pahl
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
Miniaturization is a key issue to achieve advanced performance of electronic devices and to decrease the overall cost of an electronic package. In this respect the flip chip technology provides excellent capabilities to meet the demands of recent and
Publikováno v:
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
The first part of the study focuses on fundamental investigations performed on printed ICA test structures (epoxy vs. thermoplastic resin). Measurings of the conductivity during cure have been made. The results have been related with DSC/TMA data. As