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pro vyhledávání: '"Julia Chiu"'
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Traditional laser scribe which utilizes a nanosecond laser to ablate metal and interlayer dielectric layers (ILD) has been widely adopted by the microelectronics packaging industry as the gold standard for laser scribe processing in die prep singulat
Autor:
Leimei Julia Chiu
Publikováno v:
Design Management Journal (Former Series). 12:72-78
If boldness and creativity are the keys to success in international markets, then several Japanese initiatives—richly illustrated here by Leimei Julia Chiu—hold great promise. These are programs—RE Design: Daily Products of the Twenty-first Cen