Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Jui-I Yu"'
Publikováno v:
MATERIALS TRANSACTIONS. 48:1554-1557
ATR-FTIR apparatus is used to measure the curing rate of PMDA-ODA polyimide film in order to avoid sinusoidal interference fringe. From the corrected height method, the curing rate is found to have positive correlative trend with the curing temperatu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::234c0cd12967c6e02e24ed66681f1181
https://doi.org/10.2320/matertrans.mer2007045
https://doi.org/10.2320/matertrans.mer2007045
Publikováno v:
Catalysis Letters. 77:165-169
The catalytic reaction of benzaldehyde with n-heptaldehyde was studied at 100–175°C in a stirred batch autoclave reactor using mesoporous molecular sieve Al-MCM-41 supported MgO. Competitive reactions of cross- versus self-aldolization produce α-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a176d71290b572f0d758e79e4bc1595
https://doi.org/10.1023/a:1012735011521
https://doi.org/10.1023/a:1012735011521
Publikováno v:
Reaction Kinetics and Catalysis Letters. 72:365-372
Calcined Mg-Al hydrotalcites (CHT) with various Mg/Al atomic ratios were prepared and characterized by XRD, BET and TPD of carbon dioxide. The CHT catalysts were utilized for the synthesis of α-pentylcinnamaldehyde (α-Pc) from benzaldehyde and n-he
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8d9c087907eb9eb59509c9c2911913b
https://doi.org/10.1023/a:1010571703071
https://doi.org/10.1023/a:1010571703071
Autor:
Homing Tong, Ker-Chang Hsieh, Simon Su, Tom Tai, Adren Hsieh, Jui-I Yu, Rick Yu, Walter Jau, Danial Huang
Publikováno v:
2006 International Microsystems, Package, Assembly Conference Taiwan.
Wafer bumping is growing in importance with the increasing used of Flip Chip package. In this study, we tried to determine which factors at photosensitive film lithography process had an effect on photosensitive film sidewall profile. The analysis of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b999c1e768858c582634099b587b2c2e
https://doi.org/10.1109/impact.2006.312207
https://doi.org/10.1109/impact.2006.312207
Publikováno v:
56th Electronic Components and Technology Conference 2006.
Wafer bumping is growing in importance with the increasing used of flip chip package. In this study, we tried to determine which factors at photosensitive film lithography process had an effect on photosensitive film sidewall profile. The analysis of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46624a4233894559232a1ce12b3f733e
https://doi.org/10.1109/ectc.2006.1645782
https://doi.org/10.1109/ectc.2006.1645782
Autor:
C.H. Kang, Ker-Chang Hsieh, J. Taguibao, Homing Tong, Jami Chen, T. Tai, R. Yu, Jui-I Yu, Mars Tsai
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
A technique for 100 mum fine pitch bump process characteristics with stack thin film as under bump metallization structure, such as Ti/Cu/Ni and Ti/NiV/Cu were investigated and appropriated these UBM structure for height density solder bump as interc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb0ae3fe602ec36b0e504f50f35652b8
https://doi.org/10.1109/eptc.2005.1614455
https://doi.org/10.1109/eptc.2005.1614455
87
Three types of solid base catalysts are utlized: (1) the mesoporous molecular sieve Al-MCM-41 impregnated with magnesium oxide and calcium oxide, respectively; (2) Alkaline earth metal oxides: MgO, CaO, SrO and BaO; (3) hydrotalcites. The cat
Three types of solid base catalysts are utlized: (1) the mesoporous molecular sieve Al-MCM-41 impregnated with magnesium oxide and calcium oxide, respectively; (2) Alkaline earth metal oxides: MgO, CaO, SrO and BaO; (3) hydrotalcites. The cat
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/66169896018061324142
Autor:
Jui-i Yu, Yu, R., Tai, T., Huang, D., Jau, W., Ker-Chang Hsieh, Hsieh, A., Su, S., Homing Tong
Publikováno v:
2006 International Microsystems, Package, Assembly Conference Taiwan; 2006, p1-3, 3p
Publikováno v:
56th Electronic Components & Technology Conference 2006; 2006, p5-5, 1p
Autor:
Yu, R., Jui-I Yu, Tai, T., Kang, C.H., Jami Chen, Taguibao, J., Mars Tsai, Homing Tong, Ker-Chang Hsieh
Publikováno v:
2005 7th Electronic Packaging Technology Conference; 2005, p6-6, 1p