Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Juergen Auersperg"'
Assessing MEMS devices from the point of view of functional or thermomechanical reliability, the quantitative knowledge of two basic mechanical characteristics, material strain and stress, plays a significant part. Mechanical behavior of moving MEMS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef01ce0e6577e15a9f2054c8805d59bc
https://doi.org/10.1016/b978-0-12-817786-0.00040-2
https://doi.org/10.1016/b978-0-12-817786-0.00040-2
Autor:
Timo Aalto, Veli-Matti Airaksinen, Stephan Gerhard Albert, Giorgio Allegato, Marco Amiotti, Olli Anttila, Juergen Auersperg, Antonio Bonucci, Indranil Ronnie Bose, Tanja Braun, Mikael Broas, J. Burggraf, Christopher Cameron, Rob N. Candler, Zhen Cao, André Cardoso, Kuo-Shen Chen, Andrea Conte, Adriana Cozma, Cristina E. Davis, Sophia Dempwolf, Pradeep Dixit, Michael Dost, Viorel Dragoi, Simo Eränen, Bruno Fain, B. Figeys, Andreas C. Fischer, Christoph Flötgen, Sami Franssila, Alois Friedberger, Marc Fueldner, Maria Ganchenkova, Pilar Gonzalez, Miguel A. Gosálvez, Michael Grimes, Atte Haapalinna, Paul Hagelin, Paul Hammond, Kimmo Henttinen, Vesa Henttonen, David Horsley, Takeo Hoshi, Satoshi Itoh, Henrik Jakobsen, R. Jansen, Kerstin Jonsson, Dirk Kähler, Harindra Kumar Kannojia, Hannu Kattelus, Gudrun Kissinger, Roy Knechtel, Kathrin Knese, Kai Kolari, Mika Koskenvuori, Heikki Kuisma, Amit Kulkarni, Franz Laermer, Christof Landesberger, Christina Leinenbach, Michael K. LeVasseur, Jue Li, Yuyuan Lin, Paul F. Lindner, K. Lodewijks, Fabian Lofink, Giorgio Longoni, Sebastian Markus Luber, M. Mahmud-ul-hasan, Jari Mäkinen, Matti Mäntysalo, Devin Martin, Federico Maspero, Toni T. Mattila, Luca Mauri, Peter Merz, Doug Meyer, Marco Moraja, Teruaki Motooka, Gerhard Müller, Paul Muralt, Risto M. Nieminen, Frank Niklaus, Laura Oggioni, Juuso Olkkonen, Elmeri Österlund, Kuang-Shun Ou, Jari Paloheimo, Toni P. Pasanen, Mervi Paulasto-Kröckel, Thomas Plach, Jean-Philippe Polizzi, Klaus Pressel, Matti Putkonen, Riikka L. Puurunen, Wolfgang Reinert, Enea Rizzi, V. Rochus, Glenn Ross, X. Rottenberg, Lauri Sainiemi, Hele Savin, Harald Schenk, Marc Schikowski, Matthias Schulze, S. Seema, S. Severi, Lasse Skogström, Tadatomo Suga, Scott Sullivan, Tommi Suni, Horst Theuss, Markku Tilli, H.A.C. Tilmans, Ilkka Tittonen, Hannah Tofteberg, Pekka Törmä, Santeri Tuomikoski, Frode Tyholdt, Tsuyoshi Uda, Örjan Vallin, Carlo Valzasina, Timo Veijola, Eeva Viinikka, Dietmar Vogel, Andreas Vogl, Vesa Vuorinen, W.J. Westervelde, Sebastian Wicht, Robert Wieland, Bernhard Winkler, Levent Yobas, Luca Zanotti, I. Zubel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16f0bddf47c3d8c3eaa0f0359a359b22
https://doi.org/10.1016/b978-0-12-817786-0.00065-7
https://doi.org/10.1016/b978-0-12-817786-0.00065-7
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Progressive miniaturization and functional integration in the field of BEoL structures of modern CMOS components call for the use of new materials (porous or nanoparticles filled) in connection with completely new manufacturing technologies. Residual
Publikováno v:
2015 China Semiconductor Technology International Conference.
Knowledge and control of local stress development in BEoL stacks and nearby TSVs in advanced 3D integrated devices is a key to their thermo-mechanical reliability. The paper presents a combined simulation / measurement approach to evaluate stresses g
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
The ongoing development towards increasing functional density and performance drives the improvement of IC packaging and interconnection technologies. However, new integration technologies, such as through silicon vias (TSVs) for 3D stacking for hete
Publikováno v:
2012 International Semiconductor Conference Dresden-Grenoble (ISCDG).
The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
The application of copper-TSVs for 3D-IC-integration generates novel challenges for reliability analysis and prediction, i.e. to master multiple failure criteria for combined loading including residual stresses, interface delamination, cracking and f
Publikováno v:
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials on mic
Design studies of electronics components on the basis of parameterized Finite Element Models and DoE/RSM-approaches (Design of Experiments/Response Surface Methods) are more and more performed for optimizations at early phases of the product developm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd9fb5e82c7130b2e3d8713ba4ab28fc
https://doi.org/10.1016/s1570-7946(08)80005-3
https://doi.org/10.1016/s1570-7946(08)80005-3
Autor:
Juergen Keller, Dietmar Vogel, Juergen Auersperg, Bernd Michel, Astrid Gollhardt, Neus Sabaté
Publikováno v:
SPIE Proceedings.
The paper comprises research results obtained for stress determination on micro and nanotechnology components. It meets the concern of controlling stresses introduced to sensors, MEMS and electronics devices during different micromachining processes.