Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Jue-Hsien Chern"'
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 6:297-305
The SPEC system for capturing and managing semiconductor fabrication process information is discussed. The SPEC data model decomposes process specifications into equipment, step, process, and flow hierarchies. Mechanisms within an interactive graphic
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 12:1726-1733
Algorithms for transient mixed-level circuit and device simulation using a full two-carrier three-dimensional (3-D) device simulator SIERRA and the circuit simulator SPICE3 are presented. Circuit and device simulator coupling algorithms that are suit
Autor:
R. Rutenbar, C. Sodini, Jue-Hsien Chern, E. Naviasky, D. Saias, Shekhar Borkar, Robert W. Brodersen, Georges Gielen
Publikováno v:
DAC
This panel discusses the following topics. With the ongoing trend towards more and more digitization in applications ranging from multimedia to telecommunications, there is a big debate about whether there will remain a need for analog circuits in sc
Publikováno v:
Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits.
Publikováno v:
ICCAD
Two techniques for general circuit simulation, an intelligent, partial Gauss-Seidel scheme (PGS) and a preconditioned conjugate-gradient scheme (PLUCGS), are described. Both techniques are robust and accurate for bipolar and MOS analog and digital ci
Autor:
Jue-Hsien Chern, Mi-Chang Chang
Publikováno v:
1993 International Symposium on VLSI Technology, Systems, and Applications Proceedings of Technical Papers.
The problems of prematured snapback and false multiple breakdown are found in simulating semiconductor devices in the high temperature region. The only way to achieve accurate and efficient electrothermal simulation under these conditions is by adapt
Publikováno v:
ICCAD
The authors describe algorithms for transient mixed-level circuit and device simulation using a two-carrier three-dimensional device simulator SIERRA and the circuit simulator SPICE3. It is pointed out that algorithms well suited to 2D mixed-level ci
Publikováno v:
International Electron Devices Meeting 1991 [Technical Digest].
Two- and three-dimensional simulators have been developed to investigate the electrothermal operation of semiconductor devices and conditions for onset of thermally activated second breakdown. There are two distinct breakdown modes, one associated wi
Publikováno v:
ICCAD
The authors present a general purpose, parallel matrix solver based on the conjugate gradient squared (CGS) method which features a novel preconditioning scheme commensurate with massive parallel computing. The solver algorithm has been successfully