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Autor:
Michael Schmidt, Alexander Wittmann, F. Kaufmann, Jakob Ermer, Kerstin Schaumberger, Judith Saffer, Stephan V. Roth
Publikováno v:
Procedia CIRP. 94:622-626
Due to the tendency of miniaturization of electronic components, the increased use of thermally sensitive circuit boards e.g. LCDs, a large number of requirements arises for a selective laser beam soldering process. To enhance the possibilities of se