Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Juan C. Viera"'
Autor:
Joaquín F. Pedrayes, Enrique E. Zaldivar, María F. Quintana, Gonzalo A. Orcajo, Manés F. Cabanas, Juan C. Viera
Publikováno v:
Applied Sciences, Vol 14, Iss 21, p 9939 (2024)
This article presents a new method for obtaining the electrical parameters of a supercapacitor (SC) modeled as a constant resistor in series with a capacitance that linearly varies with its internal voltage. This model provides sufficiently accurate
Externí odkaz:
https://doaj.org/article/55061adb2e4d48f8b35700e13d09f05c
Autor:
David Ansean, Manuela Gonzalez, Victor M. Garcia, Juan C. Viera, Juan C. Anton, Cecilio Blanco
Publikováno v:
IEEE Transactions on Industry Applications. 51:1855-1863
Autor:
David Anseán, Matthieu Dubarry, Arnaud Devie, Bor Yann Liaw, Víctor M. García, Juan C. Viera, Manuela González
Publikováno v:
ECS Meeting Abstracts. :900-900
Metallic lithium plating (Li plating) is considered one of the most detrimental phenomenon in lithium ion batteries (LIB), as it not only leads to further aging but also to safety deterioration [1], [2]. Li plating occurs during charge, when Li ions
Autor:
Pedrayes, Joaquín F., Zaldivar, Enrique E., Quintana, María F., Orcajo, Gonzalo A., Cabanas, Manés F., Viera, Juan C.
Publikováno v:
Applied Sciences (2076-3417); Nov2024, Vol. 14 Issue 21, p9939, 21p
Autor:
Olsson, Linda
Publikováno v:
International Journal of Climate Change: Impacts & Responses; Sep2019, Vol. 11 Issue 3, p1-13, 13p
Publikováno v:
Journal of Multiple-Valued Logic & Soft Computing; 2019, Vol. 32 Issue 3/4, p343-367, 25p
Publikováno v:
2016 IEEE Industry Applications Society Annual Meeting; 2016, p1-8, 8p
Publikováno v:
IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society; 2016, p1-263, 263p
Publikováno v:
IEEE Transactions on Industry Applications; Mar2015, Vol. 51 Issue 2, pC1-C1116, 1116p
Autor:
Ansean, David, Gonzalez, Manuela, Garcia, Victor M., Viera, Juan C., Anton, Juan C., Blanco, Cecilio
Publikováno v:
IEEE Transactions on Industry Applications; Mar2015, Vol. 51 Issue 2, p1855-1863, 9p