Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Juan Andres Torres"'
Publikováno v:
European Journal of Operational Research. 280:453-468
In this paper, we investigate the manufacturing of vias in integrated circuits with a new technology combining lithography and Directed Self Assembly (DSA). Optimizing the production time and costs in this new process entails minimizing the number of
For shear-critical structural elements where the use of stirrups is not desirable, such as slabs or beams with reinforcement congestion, steel fibers can be used as shear reinforcement. The contribution of the steel fibers to the shear capacity lies
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f0f49873b73dd741394761aa43becdbc
https://doi.org/10.20944/preprints201908.0301.v1
https://doi.org/10.20944/preprints201908.0301.v1
In this paper, we investigate the $k$-path coloring problem, a variant of vertex coloring arising in the context of integrated circuit manufacturing. In this setting, typical industrial instances exhibit a `tree-like' structure. We exploit this prope
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::db03f14f391af344e22fd0af6bf30308
https://hal.archives-ouvertes.fr/hal-02148034
https://hal.archives-ouvertes.fr/hal-02148034
Autor:
Alexander Tritchkov, Geert Vanderberghe, Neal Lafferty, Yuansheng Ma, Joost Bekaert, Germain Fenger, Juan Andres Torres, Le Hong, Rachit Gupta, Yuan He, Junjiang Lei, James Word, George P. Lippincott
Publikováno v:
Alternative Lithographic Technologies VII.
In this paper, we present an optimization methodology for the template designs of sub-resolution contacts using directed self-assembly (DSA) with grapho-epitaxy and immersion lithography. We demonstrate the flow using a 60nm-pitch contact design in d
Publikováno v:
SPIE Proceedings.
Multi-patterning (MP) is the process of record for many sub-10nm process technologies. The drive to higher densities has required the use of double and triple patterning for several layers; but this increases the cost of the new processes especially
Autor:
Kafai Lai, Yongan Xu, Chi-Chun Liu, Yuansheng Ma, Ananthan Raghunathan, Joerg Mellman, Fan Jiang, Juan Andres Torres, Cheng Chi
Publikováno v:
SPIE Proceedings.
We have performed a systematic study regarding the diblock composition to keep the size of the cylinders relatively constant despite the shape of the guiding pattern. We have also explored how some guiding patterns shapes provide acceptable cylindric
Autor:
Daman Khaira, Junjiang Lei, Joydeep Mitra, Juan Andres Torres, James Word, Harry J. Levinson, Yan Wang, Yuansheng Ma, Germain Fenger, Jongwook Kye, Le Hong, Moshe Preil
Publikováno v:
Journal of Micro/Nanolithography, MEMS, and MOEMS. 15:031610
We present a directed self-assembly (DSA) compliant flow for contact/via layers with immersion lithography assuming the graphoepitaxy process for the cylinders’ formation. We demonstrate that the DSA technology enablement needs co-optimization amon
Autor:
Valeriy Sukharev, Armen Kteyan, Nikolay Khachatryan, Henrik Hovsepyan, Juan Andres Torres, Jun-Ho Choy, Ara Markosian, Ehrenfried Zschech, Shinichi Ogawa, Paul S. Ho
Publikováno v:
AIP Conference Proceedings.
Potential challenges with managing mechanical stress distributions and the consequent effects on device performance for advanced 3D through‐silicon‐via (TSV) based technologies are outlined. A set of physics‐based compact models of a multi‐sc
Publikováno v:
Design and Process Integration for Microelectronic Manufacturing III.
It has been published that there is potential benefit to utilizing an OPC model based upon defocus instead of best focus processing, to give more robust patterning. While this is true with respect to gross opens and bridging problems, the available C
Autor:
Juan Andres Torres, Travis E. Brist
Publikováno v:
SPIE Proceedings.
Lithography models calibrated from experimental data have been used to determine the optimum insertion strategy of sub-resolution assist features in a 130 nm process. This work presents results for 3 different illumination types: Standard, QUASAR, an