Zobrazeno 1 - 10
of 11
pro vyhledávání: '"JuHoon Yoon"'
Autor:
Juhoon Yoon, Dong Su Ryu, Byong Jin Kim, YoungWoo Lee, DaeByoung Kang, GyuIck Jung, Jae Ung Lee, ChoongHoe Kim, EunNaRa Cho, JinYoung Khim, Sun-Joong Kim
Publikováno v:
Journal of the Microelectronics and Packaging Society. 23:43-48
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad0223858f52cd4bd40eb123e986b51a
https://doi.org/10.6117/kmeps.2016.23.4.043
https://doi.org/10.6117/kmeps.2016.23.4.043
Autor:
Juhoon Yoon, YongHo Son, SeoungJoon Hong, DaeByoung Kang, KiDong Sim, DaeHo Moon, Byong Jin Kim, JinYoung Khim
Publikováno v:
Journal of the Microelectronics and Packaging Society. 23:31-34
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68730bac0aafaf8a9a6a50436bdc113a
https://doi.org/10.6117/kmeps.2016.23.4.031
https://doi.org/10.6117/kmeps.2016.23.4.031
Autor:
Jin Young Kim, Choonheung Lee, Cha Gyu Song, Sung-Hoon Choa, Eun-Sook Sohn, Hoon Sun Jung, Juhoon Yoon, DaeByoung Kang
Publikováno v:
Nanoscience and Nanotechnology Letters. 8:1-7
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7f951019472b2cebb303bdbfc6a4e66
https://doi.org/10.1166/nnl.2016.2095
https://doi.org/10.1166/nnl.2016.2095
Publikováno v:
Journal of the Microelectronics and Packaging Society. 22:41-45
RtMLF (Routable Molded Lead Frame) based on molded substrate has been developed to maximize advantages of both leadframe product which has high thermal and electrical performance and laminate product which accommodates more I/O count and keeps fan-in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3605a0ce28e6ed7d14ce92f7b87ccdf8
https://doi.org/10.6117/kmeps.2015.22.2.041
https://doi.org/10.6117/kmeps.2015.22.2.041
Autor:
KwangSeok Oh, Jemmy Sutanto, Juhoon Yoon, Robert Lanzone, Ron Huemoeller, DaeByoung Kang, Michael Oh
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000916-000936
This paper describes the ongoing 3 years research and development at Amkor Technology on CoC (Chip on Chip)/FtF (Face to Face) – PossumTM technology. This technology has showed a lot of interests from the microelectronics customers/industries becau
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c29481ac48c48ba17e16e84d0555ae9b
https://doi.org/10.4071/2013dpc-tp33
https://doi.org/10.4071/2013dpc-tp33
Autor:
MinJae Lee, Keun-Soo Kim, Hwankyu Kim, DaeByoung Kang, TaeKyeong Hwang, Juhoon Yoon, David Jon Hiner, Dong Wook Kim, Seokgeun Ahn
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
High throughput interconnection technology has been achieved using a multi-chip gang bonding process with an advanced chip on wafer (CoW) test vehicle (TV). The TV had 30 µm of fine-pitch copper pillar (CuP) and the bonding test was performed using
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c24317a371879b0755b352617f483977
https://doi.org/10.1109/ectc.2016.171
https://doi.org/10.1109/ectc.2016.171
Autor:
ChoongHoe Kim, Choonheung Lee, Jin Young Kim, Yanggyoo Jung, Yunseok Song, DongSu Ryu, Minho Gim, Juhoon Yoon
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Conventional flip chip technologies such as the mass reflow (MR) process and the thermal compression bonding (TCB) process are commonly used technologies in the micro assembly field. However, there is a continuous need for next generation interconnec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26a8b667c8bbaa76280019efe6534098
https://doi.org/10.1109/ectc.2016.76
https://doi.org/10.1109/ectc.2016.76
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Advanced flip chip packaging technology supports the next generation of products with increased die complexities. The increase in complexity and functionality has been driving the need to investigate fine-pitch interconnection technology with 3D inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfbce9a7a2dd16c17b6da5753d288384
https://doi.org/10.1109/ectc.2015.7159696
https://doi.org/10.1109/ectc.2015.7159696
Autor:
Dongjoo Park, Shengmin Wen, Choonheung Lee, Jinseong Kim, Juhoon Yoon, Byoungwoo Cho, Yesul Ahn, Gyuwan Han, Lou Nicholls
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Due to rapid growth in the mobile industry, Package-on-Package (PoP) has been widely adopted for 3D integration of logic and memory devices within mobile handsets, and other portable multimedia products, etc. Typical PoP configuration includes a logi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4fa3a8ba436ad58a168cc8d8417c19b8
https://doi.org/10.1109/ectc.2014.6897469
https://doi.org/10.1109/ectc.2014.6897469
Autor:
Akito Yoshida, Byoungwoo Cho, Jinseong Kim, Yesul Ahn, Dongjoo Park, Juhoon Yoon, Gyuwan Han, Choon Heung
Publikováno v:
2013 3rd IEEE CPMT Symposium Japan.
Package-on-package (PoP) has been widely adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. Typical PoP solution is applied to logic processor as bottom package and memory device as top packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::976ade6b0c513699ac1a9445aee25d90
https://doi.org/10.1109/icsj.2013.6756077
https://doi.org/10.1109/icsj.2013.6756077