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pro vyhledávání: '"JuHong Shin"'
Autor:
Ji Hun Lee, JaeYoon Kim, EunYoung Lee, KyeRyung Kim, WonChul Do, SeHwan Hong, MinKeon Lee, David Jon Hiner, JuHong Shin
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In this work, a hybrid 3D package combining a redistribution layer (RDL) and laminate substrate layer for ultra-thin and high-bandwidth mobile applications are discussed and demonstrated. The motivation behind this hybrid 3D package structure was lev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ba2ac072bfe121f3091f31cefecb76b
https://doi.org/10.1109/eptc50525.2020.9315082
https://doi.org/10.1109/eptc50525.2020.9315082
