Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Ju-Suk Kang"'
Publikováno v:
Nanoscience and Nanotechnology Letters. 10:1292-1296
Publikováno v:
Journal of nanoscience and nanotechnology. 19(7)
Electroless nickel immersion gold (ENIG) has been widely used for surface finishing in PCB industry, however surface defects are sometimes found during PCB soldering process. These defects cause failures in soldering on PCB and consequently cause poo
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
Electroless Cu plating has been used in PCB industry when circuit was made upon non-conductive substrate. Adhesion is getting important since the size of L/P is reduced. The adhesion of copper on substrate is mainly dependent on Pd activation and cop
Publikováno v:
2012 IEEE Vehicle Power and Propulsion Conference.
In this paper, effects of leakage inductance components in active clamped flyback inverter are analyzed. In this active clamped flyback inverter, the leakage inductance influences on the control time of the active clamp switch, the voltage across the
Publikováno v:
Proceedings of The 7th International Power Electronics and Motion Control Conference.
In this paper, a sensorless current balancing and MPPT control for photovoltaic AC module type interleaved flyback inverter is proposed. A conventional interleaved flyback inverter for photovoltaic(PV) AC module systems performs the current balancing
Publikováno v:
2012 IEEE Vehicle Power & Propulsion Conference; 1/ 1/2012, p1379-1383, 5p