Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Jr. James Lupton Hedrick"'
Autor:
Jr. James Lupton Hedrick, Brian Samuel Beaman, Keith E. Fogel, Da-Yuan Shih, Paul A. Lauro, Yun-Hsin Liao
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
New sockets have been-designed and fabricated for testing advanced BGA modules. The socket can easily be custom designed to match any BGA footprint, size and pitch. The socket materials, including the contact metallurgy, frame and the elastomeric mat
Autor:
Paul A. Lauro, Fuad E. Doany, Leathen Shi, Brian Samuel Beaman, George Frederick Walker, Jane Margaret Shaw, Maurice Heathcote Norcott, D.-Y. Shih, Jr. James Lupton Hedrick, Keith E. Fogel
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
Elasticon connectors have been developed for a wide variety of interconnection and test applications which include module-to-board, board-to-board interconnections; high density module, board and LCD testings; as well as chip/wafer testing and burn-i
Publikováno v:
MRS Proceedings. 445
The present study is directed to a new foamed elastomer composition for supporting the interconnecting conductive wires in the Elasticon™ interposer connector for the packaging interconnections, test and burn‐in applications. The compressibility
Publikováno v:
MRS Proceedings. 431
Infrared spectroscopy and optical waveguide were used to determine the porosity of polymer nanofoams produced from block copolymers of an aromatic polyimide endcapped with either poly(propylene oxide) or poly(a-methylstyrene). The infrared absorption