Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Jp. Pierrel"'
Autor:
G. Imbert, Laetitia Castagne, Gilles Simon, F. Casset, Pascal Chevalier, N. Chevrier, B. Kholti, L. Toffanin, Sébastien Petitdidier, F. Bailly, Jp. Pierrel, D. Mermin, R. Franiatte, C. Ferrandon
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
A mechanical study of silicon interposer bow reduction, from wafer level manufacturing to large die stacking including analytical modeling, is presented in this paper. Indeed, understanding and reducing the warpage of a dissymmetrical substrate is fu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5850f68bc6ecd5229641ea5556d1a7a1
https://doi.org/10.1109/estc.2016.7764485
https://doi.org/10.1109/estc.2016.7764485
