Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Jozef Vincenc Oboňa"'
Autor:
Jozef Vincenc Oboňa, Lukáš Hladík, Martin Burán, Boris Arnold Rottwinkel, Michael Krause, Tomáš Borůvka, Rodrigo Delgadillo Blando, Scott Fuller
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents a large-volume workflow for fast failure analysis of microelectronic devices. The workflow incorporates a stand-alone ps-laser ablation tool and a FIB-SEM system. As implemented, the picosecond laser is used to quickly remove larg
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9778c408985b55ef0fd40c71cd9480a2
https://doi.org/10.31399/asm.cp.istfa2021p0283
https://doi.org/10.31399/asm.cp.istfa2021p0283
Publikováno v:
International Symposium for Testing and Failure Analysis.
A protocol for obtaining an advanced TEM lamella geometry using FIB-SEM is presented. Lamella lift-out procedure might require multiple manipulation steps or even breaking the vacuum in order to reach inverted or plan-view lamella geometries. We have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f8e48343a28aa6e7984c7cec44b2f43
https://doi.org/10.31399/asm.cp.istfa2020p0141
https://doi.org/10.31399/asm.cp.istfa2020p0141
Publikováno v:
International Symposium for Testing and Failure Analysis.
As the semiconductor industry demands higher throughput for failure analysis, there is a constant need to rapidly speed up the sample preparation workflows. Here we present extended capabilities of the standard Xe plasma Focused Ion Beam failure anal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8bf30c477314d120590a578953476815
https://doi.org/10.31399/asm.cp.istfa2020p0017
https://doi.org/10.31399/asm.cp.istfa2020p0017
Publikováno v:
Microscopy and Microanalysis. 23:484-490
We report on the mitigation of curtaining artifacts during transmission electron microscopy (TEM) lamella preparation by means of a modified ion beam milling approach, which involves altering the incident angle of the Ga ions by rocking of the sample
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1f29ce83b00fb66524258943a7c3c6a8
https://doi.org/10.1017/s1431927617000241
https://doi.org/10.1017/s1431927617000241
Publikováno v:
Microscopy and Microanalysis. 26:1980-1981
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7baa15775c44d99ba0bca83f853bb3b8
https://doi.org/10.1017/s1431927620020012
https://doi.org/10.1017/s1431927620020012
Autor:
Jozef Vincenc Oboňa, James P. Best, Marcus Morstein, Johannes Zechner, Johann Michler, Juri Wehrs, Ivan Shorubalko
Publikováno v:
Scripta Materialia. 112:71-74
While small-scale fracture toughness measurements provide an extremely useful material parameter, notch preparation and ion-beam damage continue to be contentious issues. Herein we utilize a conventional gallium source for notching ceramic cantilever
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22f3c3c2518c959afe68a184c3984afc
https://doi.org/10.1016/j.scriptamat.2015.09.014
https://doi.org/10.1016/j.scriptamat.2015.09.014
Autor:
G.R.B.E. Römer, Albert J. Huis in t’ Veld, J.Z.P. Skolski, Jozef Vincenc Oboňa, Jeff Th. M. De Hosson, Vaclav Ocelik
Publikováno v:
ICALEO 2014 Congress Proceedings
Electron back-scatter diffraction (EBSD) technique, commonly used to study the microstructural characteristics of materials, was employed for the investigation of the surface damage induced through ultra-short laser pulses. Single-crystal silicon sur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::713a0c2e8d1cfc391762913b3bd1d68b
http://www.mendeley.com/research/microstructural-characterization-surface-damage-through-ultrashort-laser-pulses
http://www.mendeley.com/research/microstructural-characterization-surface-damage-through-ultrashort-laser-pulses
