Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Jouve, Amandine"'
Publikováno v:
In Microelectronic Engineering 2006 83(4):1103-1106
Autor:
Loic Sanchez, Maxence Laugier, Emmanuel Rolland, Jouve Amandine, Frank Fournel, C. Castan, Severine Cheramy, Brigitte Montmayeul, R. Franiatte
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Die-To-Wafer hybrid bonding process is foreseen by major microelectronic industrials as essential for the success of future memory, HPC or photonic devices. However, compared to Wafer-To-Wafer bonding, the process flow is much more complex and the di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c45cc8abfc571c67aac429bfb8ab9959
https://doi.org/10.1109/ectc.2019.00041
https://doi.org/10.1109/ectc.2019.00041
Autor:
Taluy, Alisée, Lhostis, Sandrine, Jouve, Amandine, Garnier, Gennie, Dezandre, Emilienne, Farcy, Alexis, Chéramy, Séverine, Sillon, Nicolas, Sylvestre, Alain
Publikováno v:
EPTC : Electronics Packaging Technology Conference 2011
EPTC : Electronics Packaging Technology Conference
EPTC : Electronics Packaging Technology Conference, Dec 2011, Singapour, Singapore
EPTC : Electronics Packaging Technology Conference
EPTC : Electronics Packaging Technology Conference, Dec 2011, Singapour, Singapore
International audience; This paper deals with the performances of Wafer-Level UnderFill in ultra-fine 50 microns pitch interconnections. Firstly, dry-film WLUF assembly feasibility has been demonstrated by checking lamination and planarity in the pil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::6f5f71480bc945d0422a35c8bc7cd0e3
https://hal.archives-ouvertes.fr/hal-00659189
https://hal.archives-ouvertes.fr/hal-00659189
Publikováno v:
MNE05 Conference
MNE05 Conference, 2005, Vienna, Austria
MNE05 Conference, 2005, Vienna, Austria
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::dbb944676df56b495e6afccae0519518
https://hal.archives-ouvertes.fr/hal-00023202
https://hal.archives-ouvertes.fr/hal-00023202
Autor:
Elloumi, M., Jouve, Amandine
Publikováno v:
Agriculture et alimentation en Méditerranée : les défis de la mondialisation
Agriculture et alimentation en Méditerranée : les défis de la mondialisation, Karthala, 2004, 2-8458-6561-9
Agriculture et alimentation en Méditerranée : les défis de la mondialisation, Karthala, 2004, 2-8458-6561-9
National audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::4153cf212b46a7f31e3a67eccf880113
https://hal.inrae.fr/hal-02833989
https://hal.inrae.fr/hal-02833989
Autor:
Colonna, Jean-Philippe, Coudrain, Perceval, Garnier, Gennie, Chausse, Pascal, Segaud, Roselyne, Aumont, Christophe, Jouve, Amandine, Hotellier, Nicolas, Frank, Thomas, Brunet-Manquat, Catherine, Cheramy, Severine, Sillon, Nicolas
Publikováno v:
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p796-802, 7p
Autor:
Taluy, Alisee, Lhostis, Sandrine, Jouve, Amandine, Garnier, Gennie, Dezandre, Emilienne, Farcy, Alexis, Cheramy, Severine, Sillon, Nicolas, Sylvestre, Alain
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p129-134, 6p
Akademický článek
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Autor:
Vivet, Pascal, Bernard, Christian, Clermidy, Fabien, Dutoit, Denis, Guthmuller, Eric, Panades, Ivan-Miro, Pillonnet, G., Thonnart, Yvain, Garnier, Arnaud, Lattard, Didier, Jouve, Amandine, Bana, Franck, Mourier, Thierry, Cheramy, Severine
Publikováno v:
2015 International 3D Systems Integration Conference (3DIC); 2015, pFS6.1-FS6.3, 0p