Zobrazeno 1 - 10
of 899
pro vyhledávání: '"Joungho Kim"'
Publikováno v:
Journal of Advanced Joining Processes, Vol 5, Iss , Pp 100099- (2022)
Flex-on-board (FOB) interconnection plays an important role in display applications. Due to the thinness of the interconnect, the contact resistance of anisotropic conductive film (ACF) joints is very small; however, the transmission property of ACF
Externí odkaz:
https://doaj.org/article/56e6665aa5f84a039eb5eaa0e05b9338
Autor:
Seungtaek Jeong, Tae-Wook Kim, Seongsoo Lee, Boogyo Sim, Hyunwook Park, Kyungjune Son, Keeyoung Son, Seongguk Kim, Taein Shin, Young-Cheon Kim, Joungho Kim, Byoung-Joon Kim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1748-1756
Autor:
Hyunwook Park, Minsu Kim, Seongguk Kim, Keunwoo Kim, Haeyeon Kim, Taein Shin, Keeyoung Son, Boogyo Sim, Subin Kim, Seungtaek Jeong, Chulsoon Hwang, Joungho Kim
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 70:4772-4786
In this article, for the first time, we propose a transformer network-based reinforcement learning (RL) method for power distribution network (PDN) optimization of high bandwidth memory (HBM). The proposed method can provide an optimal decoupling cap
Autor:
Keeyoung Son, Seongguk Kim, Hyunwook Park, Taein Shin, Keunwoo Kim, Minsu Kim, Boogyo Sim, Subin Kim, Gapyeol Park, Shinyoung Park, Seungtaek Jeong, Joungho Kim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1542-1556
Autor:
Youngwoo Kim, Joungho Kim, Daehwan Lho, Kyungjun Cho, Seongguk Kim, Subin Kim, Junyong Park, Jinwook Song, Hyungmin Kang, HyunWook Park, Boogyo Sim, Shinyoung Park
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 64:196-208
In this article, for the first time, we propose channel characteristic-based deep neural network (DNN) models for accurate eye-height (EH) and eye-width (EW) estimation of high bandwidth memory (HBM) silicon interposer channels. The proposed models p
Autor:
Joungho Kim, Shinyoung Park, Seungtaek Jeong, Keeyoung Son, Keunwoo Kim, Gapyeol Park, HyunWook Park, Seokwoo Hong, Min-Su Kim, Kyungjune Son, Daehwan Lho, Seongsoo Lee
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:100-110
Autor:
HyunWook Park, Daehwan Lho, Kyungjun Cho, Seongguk Kim, Gapyeol Park, Shinyoung Park, Youngwoo Kim, Kyungjune Son, Subin Kim, Seungtaek Jeong, Joungho Kim, Taein Shin
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1955-1970
In this paper, we propose a processing-in-memory of high bandwidth memory (PIM-HBM) scheme including system architecture and hardware structure. The proposed scheme embeds processing units into the logic layer of the HBM to expose an excess dynamic r
Autor:
Keeyoung Son, Daehwan Lho, Keunwoo Kim, Seonguk Choi, Haeyeon Kim, Hyunwook Park, Boogyo Sim, Hyunwoo Kim, Taein Shin, Joungho Kim
Publikováno v:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Autor:
Keeyoung Son, Daehwan Lho, Seongguk Kim, Joonsang Park, Keunwoo Kim, Namhyeon Choi, Hyunsik Kim, Joungho Kim
Publikováno v:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Autor:
Hyunwoo Kim, Haeyeon Kim, Joonsang Park, Keeyoung Son, Hyunwook Park, Taein Shin, Keunwoo Kim, Jiwon Yoon, Junghyun Lee, Jonghyun Hong, Juneyoung Kim, Joungho Kim
Publikováno v:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).