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Autor:
Jou-Chun Ou, Yi-Yun Tsai, Ting-Chun Lin, Chin-Li Kao, Shih-Chieh Hsiao, Fei-Ya Huang, Jui-Chao Kuo
Publikováno v:
AIP Advances, Vol 12, Iss 6, Pp 065201-065201-12 (2022)
Cu/SiO2 hybrid bonding has been developed for the application of heterogeneous bond interfaces in 3D integrated circuits in which thermal stability and bonding behavior are important. Thus, nano-twinned Cu (NT-Cu) is selected as the bonding material,
Externí odkaz:
https://doaj.org/article/79f7770388804ace93407681db799cbb
