Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Jou-Chun Ou"'
Autor:
Jou-Chun Ou, Yi-Yun Tsai, Ting-Chun Lin, Chin-Li Kao, Shih-Chieh Hsiao, Fei-Ya Huang, Jui-Chao Kuo
Publikováno v:
AIP Advances, Vol 12, Iss 6, Pp 065201-065201-12 (2022)
Cu/SiO2 hybrid bonding has been developed for the application of heterogeneous bond interfaces in 3D integrated circuits in which thermal stability and bonding behavior are important. Thus, nano-twinned Cu (NT-Cu) is selected as the bonding material,
Externí odkaz:
https://doaj.org/article/79f7770388804ace93407681db799cbb
Autor:
Ou, Jou-Chun, Tsai, Yi-Yun, Lin, Ting-Chun, Kao, Chin-Li, Hsiao, Shih-Chieh, Huang, Fei-Ya, Kuo, Jui-Chao
Publikováno v:
AIP Advances; Jun2022, Vol. 12 Issue 6, p1-12, 12p