Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Joshua Kasitz"'
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Passive cooling techniques are widely sought-after solutions to thermal management issues in high power electronics due to increased energy dissipation in reduced areas. Phase change materials (PCMs) present a promising secondary passive thermal mana
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbf3afbc18b89771957fe3a94d49eb15
https://doi.org/10.1115/ipack2022-97399
https://doi.org/10.1115/ipack2022-97399
Publikováno v:
Journal of Electronic Packaging. 145
High power electronics are a key component in the electrification of aircraft. Large amounts of power need to be handled onboard to generate sufficient lift for flight. The transient nature of the aircraft's mission profile produces varied loading an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a60ab1980026512077e174e52fbe3105
https://doi.org/10.1115/1.4055464
https://doi.org/10.1115/1.4055464
Autor:
Joshua Kasitz, David Huitink
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
As aircrafts move toward electrification with the research and development of hybrid-electric powertrains, the focus has begun to shift to the reliability challenges of electronic devices subject to flight. Electronic components in aircraft applicati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::041edec1f36574f42e40c2bd34e18798
https://doi.org/10.1115/ipack2021-73287
https://doi.org/10.1115/ipack2021-73287
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Thermal management plays an important role in maintaining reliable functionality in electronic systems. As electronic packaging scales for increased power density, the need for cost effective heat removal becomes vital to electronic system design. Co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::671168965a4b2e354665c020a9d51852
https://doi.org/10.1109/itherm45881.2020.9190536
https://doi.org/10.1109/itherm45881.2020.9190536