Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Joshua Baur"'
Autor:
Yash Patel, Joshua Baur, Jonathan Scholl, Adam R. Waite, Adam Kimura, John Kelley, Richard Ott, Glen David Via
Publikováno v:
EDFA Technical Articles. 23:4-13
Further development of SEM-based feature extraction tools for design validation and failure analysis is contingent on reliable sample preparation methods. This article describes how a delayering framework for 130 nm technology was adapted and used on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9c1ddc1fae00f5982dcb4a626d16c46
https://doi.org/10.31399/asm.edfa.2021-4.p004
https://doi.org/10.31399/asm.edfa.2021-4.p004
Autor:
Eric Udelhoven, Joshua Baur, Adam R. Waite, Daniel Brooks, John Kelley, Yash Patel, Richard Ott, Jon Scholl, Glen D. Via, Adam G. Kimura
This paper presents the first design reconstruction on the Front-End-of-Line and Middle-of-Line layers of a 14 nm node FinFET design. To accomplish this, a large region of interest within a custom designed 14 nm node ASIC device was delayered, imaged
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5f134dd8b0b6196cf1a1d4a3926447c9
https://doi.org/10.36227/techrxiv.15182256
https://doi.org/10.36227/techrxiv.15182256
Autor:
Joshua Baur, Adam G. Kimura, Adam R. Waite, Jonathan Scholl, John Kelley, Yash Patel, Glen D. Via
Publikováno v:
2020 IEEE Physical Assurance and Inspection of Electronics (PAINE).
This paper reviews different methods for mounting and integrated circuit (IC) for delayering. In this work, several 130nm technology devices are observed during the delayering process as a means of evaluating the advantages and disadvantages of vario
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d2ba89e9156557399624a2891c8d7b8
https://doi.org/10.1109/paine49178.2020.9337731
https://doi.org/10.1109/paine49178.2020.9337731
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents an in-depth review of the critical front end stages of the fabricated integrated circuit (IC) assurance workflow used for recovering the design stack-up of a fabricated IC. In this work, a Serial Peripheral Interface (SPI) embedde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14d1b2506e76aa07afc7e98bdfd35fe7
https://doi.org/10.31399/asm.cp.istfa2020p0202
https://doi.org/10.31399/asm.cp.istfa2020p0202