Zobrazeno 1 - 10
of 138
pro vyhledávání: '"Joseph Ya-min Lee"'
Publikováno v:
Advances in Materials Science and Engineering, Vol 2013 (2013)
Charge-trapping devices using multilayered dielectrics were studied for nonvolatile memory applications. The device structure is Al/Y2O3/Ta2O5/SiO2/Si (MYTOS). The MYTOS field effect transistors were fabricated using Ta2O5 as the charge storage layer
Externí odkaz:
https://doaj.org/article/ad16663376364ef4af874c567e05ee01
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:19554-19557
TFMG of Zr–Cu–Ni–Al–N around 10 nm thick has been shown that it could be used as a diffusion barrier due to material’s thermal properties, e.g. glass transition temperature, and super-cooled region. A tri-layered structure was demonstrated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::965aed62a6d7a229d978324152ef3357
https://doi.org/10.1007/s10854-018-0086-x
https://doi.org/10.1007/s10854-018-0086-x
Autor:
Joseph Ya-min Lee, Jenq-Gong Duh
Publikováno v:
Vacuum. 142:81-86
In this study, a Zr-Cu-Ni-Al-N thin film metallic glass (TFMG) has been developed and applied for the diffusion barrier between copper and silicon. The Si/TFMG/Cu stacked structures with various TFMG thickness have been fabricated. Rapid thermal anne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f9d0fb4bc8e127998a21839a159a96f
https://doi.org/10.1016/j.vacuum.2017.05.009
https://doi.org/10.1016/j.vacuum.2017.05.009
Publikováno v:
Surface and Coatings Technology. 310:214-222
The amorphous thin film metallic glass (TFMGs) is a promising material with superior mechanical performance, fatigue properties, corrosion resistance, unique thermal properties, and antimicrobial efficacy. In this study, newly-designed Zr-Cu-Al-Ag-N
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::495fa6231c99dea6aa361d02571a25dc
https://doi.org/10.1016/j.surfcoat.2016.12.076
https://doi.org/10.1016/j.surfcoat.2016.12.076
Publikováno v:
Materials Letters. 159:369-372
The study is intended to investigate the optimal content of nitrogen in the Zr–Cu–Ni–Al–N thin film metallic glass (TFMG) to achieve the improved mechanical and thermal properties. Various Zr–Cu–Ni–Al–N TFMGs were fabricated by manipu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e10c19ca4c6bb1c1baa6e1382b0911e0
https://doi.org/10.1016/j.matlet.2015.07.019
https://doi.org/10.1016/j.matlet.2015.07.019
Publikováno v:
Surface and Coatings Technology. 278:132-137
This study is intended to investigate the amorphicity region of Ni + Al content in Zr–Cu–Ni–Al thin film. The thermal and mechanical performances of Zr–Cu–Ni–Al thin film metallic glass (TFMG) are also addressed. By adjusting target power
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf0eb5395666be95d32b486a3b5c7452
https://doi.org/10.1016/j.surfcoat.2015.07.015
https://doi.org/10.1016/j.surfcoat.2015.07.015
Autor:
Jia Hong Chu, Jenq-Gong Duh, Jason S.C. Jang, Chun-Chi Chang, Jyh-Wei Lee, Joseph Ya-min Lee, Yu-Chen Chan, Ming Li Liou
Publikováno v:
Surface and Coatings Technology. 259:87-93
Zr-based thin film metallic glass (TFMG), exhibiting the unique properties of good glass forming ability (GFA), corrosion resistance, and biocompatibility, can be applied in various novel fields of industries. An ultra-smooth surface is obtained with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ecc3435a889c937663111ce23ed2dd8b
https://doi.org/10.1016/j.surfcoat.2014.05.019
https://doi.org/10.1016/j.surfcoat.2014.05.019
Publikováno v:
Journal of Alloys and Compounds. 600:21-28
The interfacial reaction and crystallographic orientation of Ni(P)/Au/SnAgCu/Cu and Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joints were investigated. With the aid of crystallographic analysis, the Pd influence on the grain structure and preferred grow
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::415f2b8ac6511a0017d6b4866089668d
https://doi.org/10.1016/j.jallcom.2014.02.054
https://doi.org/10.1016/j.jallcom.2014.02.054
Publikováno v:
Materials Letters. 119:20-23
In this research, the impact toughness of Sn–3.0Ag–0.5Cu/Cu (wt%, SAC305/Cu) solder joints is efficiently improved via controlling the solidification step of reflow process. During solidification step of reflow process, the solder joints were ann
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10b1718c9ed99fc3ec7c08da7d6fa64c
https://doi.org/10.1016/j.matlet.2013.12.088
https://doi.org/10.1016/j.matlet.2013.12.088
Publikováno v:
Journal of Applied Physics; Oct2010, Vol. 108 Issue 6, p064111, 4p, 3 Graphs