Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Joseph Y. Lee"'
Autor:
Deborah L. Pestka, Daniel Murphy, Pearl Huynh, Jessica A. Rechtzigel, Shari Kjos, Lisa Marie Ellich, Adam N. Kaplan, Brent C. Taylor, Melissa Atwood, Beth A. Polsfuss, Joseph Y. Lee, Areef Ishani
Publikováno v:
BMC Nephrology, Vol 25, Iss 1, Pp 1-6 (2024)
Abstract Background Patients with chronic kidney disease (CKD) are at increased risk for multiple adverse events, several of which have been proven to be less likely with the use of sodium-glucose cotransporter-2 inhibitors (SGLT2i). As a result, gui
Externí odkaz:
https://doaj.org/article/a0212570edd3438fa631338b4502b291
Autor:
Seunghyun Cho, Joseph Y. Lee
Publikováno v:
Electronic Materials Letters. 6:167-172
Thermal management issues with IC packages have been growing as electronic systems have become smaller with a higher functionality. Since the high junction temperature of IC packages induces the low performance and malfunction of electronic systems,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84d92673248c30095b043d09425942b8
https://doi.org/10.3365/eml.2010.12.167
https://doi.org/10.3365/eml.2010.12.167
Publikováno v:
Microelectronics Reliability. 50:242-250
Printed Circuit Board (PCB) warpage increases as thickness decreases and ultimately is attributed to CTE mismatch and thickness geometry of the components. Recently, a thin Ball Grid Array (BGA) PCB has been developed due to the advantages like high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e56da8155fdaf790b987304f6b6cf56e
https://doi.org/10.1016/j.microrel.2009.10.009
https://doi.org/10.1016/j.microrel.2009.10.009
Publikováno v:
Microelectronics Reliability. 48:300-309
Flip–chip substrates have been developed to meet the recent technical trend. They have a small IVH (Inner Via Hole) diameter to improve electrical packaging performance. However, under thermal loading conditions, substrate warpage increases as subs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::465ae82bcc1b191d3c84b6f2c7795f7d
https://doi.org/10.1016/j.microrel.2007.06.001
https://doi.org/10.1016/j.microrel.2007.06.001
Publikováno v:
Journal SOGC. 22:794-798
Objective: to evaluate the efficacy of tranexamic acid for essential menorrhagia. Subjects: women 18 to 45 years of age with a complaint of heavy menstrual bleeding. Design: two pre-treatment baseline cycles were compared to three consecutive treatme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::955ff4cc4a39802ad5186fcfdabad4b2
https://doi.org/10.1016/s0849-5831(16)31019-9
https://doi.org/10.1016/s0849-5831(16)31019-9
Publikováno v:
Military Medicine. 167:164-166
Chronic renal insufficiency is a condition involving the deterioration of renal function over a period of months to years. This differs from acute renal failure, which is a sudden decrease in renal function that occurs over a period of hours to days.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e776b2e0bc4ecbbe9fd4bbadffa00e0
https://doi.org/10.1093/milmed/167.2.164
https://doi.org/10.1093/milmed/167.2.164
Publikováno v:
The American Journal of Medicine. 127:e1-e2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::381d0c1b361a1b227c0d4a908206da63
https://doi.org/10.1016/j.amjmed.2014.04.032
https://doi.org/10.1016/j.amjmed.2014.04.032
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Work on the Pulse Laser Deposition (PLD) equipment is purely for research and development at Samsung Electro-Mechanics when it takes 30 minutes to complete the experiment to grow a dielectric thin film on Cu plated pieces of Si wafer. At SEMCO, low t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe379c016c5782446533e16859688f93
https://doi.org/10.1109/iemt.2008.5507849
https://doi.org/10.1109/iemt.2008.5507849
Autor:
Hyun Joon Kim, Ghun Hahm, Yong-Soo Oh, Sung-Whan Cho, Joseph Y. Lee, Ho-Joon Park, Kyoung-Soo Chae
Publikováno v:
2006 5th IEEE Conference on Sensors.
This paper presents a development of a 3D motion sensor IC which detects inertial movements and earth's magnetic fields for a compass heading. It consists of a 3-axis accelerometer, a 2-axis geomagnetic sensor, and a microcontroller. An automatic cal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6e79c12b610014f31e285553e371da4
https://doi.org/10.1109/icsens.2007.355556
https://doi.org/10.1109/icsens.2007.355556
Publikováno v:
2006 7th International Conference on Electronic Packaging Technology.
In the 1990's, both BGA (ball grid array) and CSP (chip size package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (surface mount device) from the 1980's and THD (through-hole mount dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1440a5fbf047ef4d660a3e82c1c5c7ca
https://doi.org/10.1109/icept.2006.359648
https://doi.org/10.1109/icept.2006.359648