Zobrazeno 1 - 10
of 49
pro vyhledávání: '"Joseph C. Davis"'
Autor:
Christian F. Zirbes, Nicholas J. Pitcher, Joseph C. Davis, Alyssa R. Bartels, Justin D. Krogh, Mary Teresi, Tyler Farber, Francesca Milavetz, Anthony J. Pamatmat, Alexis L. Rozen, Lindsey D. Reinhardt, Linda Boyken, Sachinkumar B. Singh, Erik Twait, Valérie C. Reeb, Bradley A. Ford, Anthony J. Fischer
Publikováno v:
Journal of cystic fibrosis : official journal of the European Cystic Fibrosis Society. 21(5)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cd2723de1c0c835634be0d9111501965
https://pubmed.ncbi.nlm.nih.gov/35491319
https://pubmed.ncbi.nlm.nih.gov/35491319
Publikováno v:
Journal of the American Statistical Association. 93:36-45
Material is deposited onto the wafer surface during several steps of wafer fabrication. This material must be deposited evenly across the entire wafer surface, close to the targeted thickness, and with little wafer-to-wafer variability. But unequal v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::745be337bc8148122c61ae49d8107c3a
https://doi.org/10.1080/01621459.1998.10474085
https://doi.org/10.1080/01621459.1998.10474085
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 11:583-590
In this paper, we present techniques that can be used to answer the following two questions: (1) how many wafers need to be allocated per treatment to detect a given difference in a device performance metric and (2) how can one determine if a given t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae22f29fea4a195ada3c9aa67b45b895
https://doi.org/10.1109/66.728555
https://doi.org/10.1109/66.728555
Autor:
P.P. Apte, Sharad Saxena, R. Burch, Joseph C. Davis, Karthik Vasanth, P.K. Mozumder, S. Rao, C. Fernando
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 11:527-536
Run-to-run and supervisory control algorithms determine the equipment recipe to produce a desired output wafer state given the incoming wafer state and the current equipment model. For simple, low-dimensional equipment models, this problem is not dif
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5db94b5a3b704c2eb7ac4029a0285ec7
https://doi.org/10.1109/66.728548
https://doi.org/10.1109/66.728548
Autor:
Jye-Chyi Lu, P.K. Mozumder, H.H. Heinisch, E.A. Rying, B.E. Hornung, S. Rao, Joseph C. Davis, R.S. Gyurcsik, Jimmie J. Wortman, M.M. Gardner
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C. 20:295-304
This paper describes a new methodology for equipment fault detection. The key features of this methodology are that it allows for the incorporation of spatial information and that it can be used to detect and diagnose equipment faults simultaneously.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::003ac0511066d514751c75c3b6e7f04c
https://doi.org/10.1109/3476.650961
https://doi.org/10.1109/3476.650961
Publikováno v:
Journal of The Electrochemical Society. 143:3404-3409
Modern statistical modeling techniques for characterizing the spatial response of a single-wafer, process are presented. These techniques overcome the limitations of the commonly used ordinary least squares estimation procedure and provide models for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf4efeaa039cf0a8b3b153dcfe389513
https://doi.org/10.1149/1.1837220
https://doi.org/10.1149/1.1837220
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C. 19:283-289
Within-wafer uniformity is traditionally measured by the signal-to-noise ratio (SNR), defined as the estimated standard-deviation of within-wafer measurements over the mean of those measurements, Unfortunately, in the presence of deterministic variat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9fcc91d270e8c1d560c58ef47876f1a7
https://doi.org/10.1109/3476.558556
https://doi.org/10.1109/3476.558556
Publikováno v:
Proceedings of the Human Factors and Ergonomics Society Annual Meeting. 39:610-614
This study investigated selective activation of different regions of the external obliques. Six subjects performed sub-maximal isometric axial twisting exertions (20%, 40%, 60% of MVC) while assuming six different postures defined by three levels of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fdc9a724e8748caabc05f0625b6989ae
https://doi.org/10.1177/154193129503901015
https://doi.org/10.1177/154193129503901015
Publikováno v:
Proceedings of the Human Factors and Ergonomics Society Annual Meeting. 38:644-648
The National Institute for Occupational Safety and Health (NIOSH) has increased the applicability of its lifting equation to a wider range of jobs by relaxing some of the simplifying assumptions of the original equation. Specifically, NIOSH has added
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccfa8c9b43054b78cda698fca6fcd6a5
https://doi.org/10.1177/154193129403801022
https://doi.org/10.1177/154193129403801022
Publikováno v:
SPIE Proceedings.
The OASIS working group was first initiated in 2001, published the new format in March 2004, which was ratified as an official SEMI standard in September 2005. A follow-on initiative expanded the new standard to cover the needs of the mask manufactur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d51a763eedc2339cba16150f4ebd88b7
https://doi.org/10.1117/12.864158
https://doi.org/10.1117/12.864158