Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Jose-Solis Camara"'
Autor:
Pulugurtha Markondeya Raj, Dieff Vital, Jose Solis Camara, Shubhendu Bhardwaj, S K Yeahia Been Sayeed
Publikováno v:
International Symposium on Microelectronics. 2019:000434-000437
In this work, we show the use of tunable ceramic type integrated passive devices for mm-wave antenna applications. The specific illustrations are made using BST (barium strontium titanate) based capacitator, whose capacitances can be changed by elect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f7d90ef4802be7dcf4282cecf5472a0
https://doi.org/10.4071/2380-4505-2019.1.000434
https://doi.org/10.4071/2380-4505-2019.1.000434
Autor:
Dieff Vital, Sk Yeahia Been Sayeed, Jose Solis Camara, Shubhendu Bhardwaj, Pulugurtha Markondeya Raj, Daniel Wilding
Publikováno v:
International Symposium on Microelectronics. 2019:000163-000168
A new class of interconnects that exhibit resilience to mechanical deformation are demonstrated with flexible fan-out or embedded-die packages. Active device embedding in flexible substrates is accomplished with direct printed interconnects onto die
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::666df9c2042f5383174566a852c6fe7f
https://doi.org/10.4071/2380-4505-2019.1.000163
https://doi.org/10.4071/2380-4505-2019.1.000163
Autor:
Shubhendu Bhardwaj, Pulugurtha Markondeya Raj, Daniel Wilding, Sepehr Soroushiani, M. M. Monshi, John L. Volakis, Sk Yeahia Been Sayeed, Jose Solis Camara
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The goal of this research is to demonstrate areaarray remateable interconnects in 3D flex or rigid-flex packages. Remateability is achieved with clamped connections between two area-array interconnect terminations using compressible z-interconnects i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1468572b92ed4e4fd59b21ac2b5ff6ea
https://doi.org/10.1109/ectc32862.2020.00111
https://doi.org/10.1109/ectc32862.2020.00111
Autor:
Shubhendu Bhardwaj, M. M. Monshi, Pulugurtha Markondeya Raj, Jose-Solis Camara, John L. Volakis
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Hybrid device-flex-textile interconnect and integration technologies were developed to realize smart wireless sensing systems. Test vehicles were fabricated to emulate high-density 3D flex packages in textiles. Representative test chips were assemble
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98855a8134becb871a3c6291400bff4b
https://doi.org/10.1109/ectc32862.2020.00136
https://doi.org/10.1109/ectc32862.2020.00136