Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Jose Luis Garcia-Gervacio"'
Autor:
M. A. Sandoval-Hernandez, Hector Vazquez-Leal, Jose Luis Garcia-Gervacio, Uriel Filobello-Nino, AgustÃn L. Herrera-May
Publikováno v:
Discrete Dynamics in Nature and Society, Vol 2019 (2019)
Transcendental functions are a fundamental building block of science and engineering. Among them, a relatively new function denominated as Lambert W is highlighted. The importance of such function relies on the fact that it can perform novel isolatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cedf0a64e24e3e36cbd20db4230dda78
https://doaj.org/article/f689a0052d1745218cbc142adf31726f
https://doaj.org/article/f689a0052d1745218cbc142adf31726f
Publikováno v:
Microelectronics Journal. 46:398-403
Bridge defects are an important manufacturing defect that may escape test causing reliability issues. It has been shown that in nanometer regime, process variations pose important challenges for traditional delay test methods lowering test quality. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f31c4445a6996058c03afdee0fc22f60
https://doi.org/10.1016/j.mejo.2015.02.006
https://doi.org/10.1016/j.mejo.2015.02.006
Publikováno v:
Microelectronics Reliability. 55:1005-1011
Subtle defects such as low resistive vias and high resistive shorts cause Small-Delay Defects that are hard to detect even by advanced test methodologies. Detection of these defects aggravates with process variations becoming an important source of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1a490db693c72cdb2c9281bf4477f73
https://doi.org/10.1016/j.microrel.2015.03.007
https://doi.org/10.1016/j.microrel.2015.03.007
Publikováno v:
Journal of Electronic Testing. 27:741-752
Interconnect imperfections have become an important issue in modern nanometer technologies. Some of them cause Small Delay Defects (SDDs) which are difficult to detect. Those SDDs not detected during testing may pose a reliability problem. Furthermor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5659ca30c4da22acf236501cf998c6e
https://doi.org/10.1007/s10836-011-5256-1
https://doi.org/10.1007/s10836-011-5256-1
Publikováno v:
IEICE Electronics Express. 15:20180475-20180475
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2458ee98e8b6611d561a3e4cc3cc1407
https://doi.org/10.1587/elex.15.20180475
https://doi.org/10.1587/elex.15.20180475
Autor:
Héctor Villacorta-Minaya, Hector Vazquez-Leal, Alfonso Herrera-Moreno, Jose Luis Garcia-Gervacio
Publikováno v:
IEICE Electronics Express. 15:20180502-20180502
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f31f5793c39735d7458a83469b79fc3
https://doi.org/10.1587/elex.15.20180502
https://doi.org/10.1587/elex.15.20180502
Autor:
Gregorio Zamora-Mejia, J. Cano-Martinez, Jaime Martinez-Castillo, Luis F. Lagunes-Aranda, S. I. Jimenez-Reyes, Jose Luis Garcia-Gervacio
Publikováno v:
2015 International Conference on Computing Systems and Telematics (ICCSAT).
Some of the flaws in the interconnection wires of digital integrated circuits can be caused by fabrication defects or wear as the effect of electromigration effect. Interconnection wires add parasitic effects such as resistances and capacitances whic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::858948b63b2d256639200a457bca7c0e
https://doi.org/10.1109/iccsat.2015.7362955
https://doi.org/10.1109/iccsat.2015.7362955
Publikováno v:
LATW
Small delay defects caused by resistive opens are very common in nanometer technologies due to the rising number of vias and metal levels. The detection of this kind of defects is a major concern in modern circuits. These defects are hard to detect a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73d2f0d4c740c7ccfc7a3b4a3cd20cb2
https://doi.org/10.1109/latw.2014.6841909
https://doi.org/10.1109/latw.2014.6841909
Autor:
Jaime Martinez, Hector Villacorta, Jaume Segura, Sebastia Bota, Victor Champac, Jose Luis Garcia-Gervacio
Publikováno v:
LATW
Bridge defects are an important manufacturing defect that may escape test. Even more, it has been shown that in nanometer regime, process variations pose important challenges for traditional delay test methods. Therefore, advances in test methodologi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51e9ee7290e4cba9e53891f4e49777af
https://doi.org/10.1109/latw.2013.6562671
https://doi.org/10.1109/latw.2013.6562671
Publikováno v:
VTS
Detection of Small Delay Defects (SDDs) is a major concern in modern circuits using nanometer technologies. They are difficult to test and an important source of test escapes, and even when SDDs do not produce functional failures, they represent a re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a3e9192d5ea14ad914acbb7a63ead41
https://doi.org/10.1109/vts.2012.6231091
https://doi.org/10.1109/vts.2012.6231091