Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Jornet, JM"'
Publikováno v:
Enfermería Dermatológica, Vol 12, Iss 33, Pp 36-41 (2018)
Las quemaduras son lesiones cutáneas causadas por agentes térmicos, químicos, radioactivos o eléctricos, que, en función del tiempo de exposición al agente causal, transmiten el calor a los distintos tejidos. Las quemaduras de tratamiento ambul
© 2017 Elsevier B.V. Enabling wireless communication between intrabody nanosensors and wearable devices can transform the field of nanobiosensing and, ultimately, lead to revolutionary healthcare systems. Recently, it has been demonstrated that such
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______363::f7f5ee650510c80000e4ea1ec1d46ab7
https://hdl.handle.net/10453/126514
https://hdl.handle.net/10453/126514
Akademický článek
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Autor:
Bodet D; Department of Electrical and Computer Engineering and Institute for the Wireless Internet of Things, Northeastern University, Boston, MA, 02115, USA. bodet.d@northeastern.edu., Petrov V; Division of Communications Systems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, 114 28, Stockholm, Sweden., Petrushkevich S; Department of Electrical and Computer Engineering and Institute for the Wireless Internet of Things, Northeastern University, Boston, MA, 02115, USA., Jornet JM; Department of Electrical and Computer Engineering and Institute for the Wireless Internet of Things, Northeastern University, Boston, MA, 02115, USA.
Publikováno v:
Scientific reports [Sci Rep] 2024 Aug 24; Vol. 14 (1), pp. 19675. Date of Electronic Publication: 2024 Aug 24.
Autor:
Dhiman S; Department of Biomedical Engineering, University at Buffalo, Buffalo, NY 14228, USA., Manoj N; Department of Pathology and Anatomical Sciences, Jacobs School of Medicine and Biomedical Sciences, University at Buffalo, Buffalo, NY 14228, USA., Liput M; Department of Pathology and Anatomical Sciences, Jacobs School of Medicine and Biomedical Sciences, University at Buffalo, Buffalo, NY 14228, USA.; Mossakowski Medical Research Center, Stem Cell Bioengineering Department, Polish Academy of Sciences, Pawinskiego Str., 02-106 Warsaw, Poland., Sangwan A; Department of Electrical Engineering, Northeastern University, Boston, MA 02115, USA., Diehl J; Department of Pathology and Anatomical Sciences, Jacobs School of Medicine and Biomedical Sciences, University at Buffalo, Buffalo, NY 14228, USA., Balcerak A; Department of Pathology and Anatomical Sciences, Jacobs School of Medicine and Biomedical Sciences, University at Buffalo, Buffalo, NY 14228, USA., Sudhakar S; Department of Pathology and Anatomical Sciences, Jacobs School of Medicine and Biomedical Sciences, University at Buffalo, Buffalo, NY 14228, USA., Augustyniak J; Department of Pathology and Anatomical Sciences, Jacobs School of Medicine and Biomedical Sciences, University at Buffalo, Buffalo, NY 14228, USA.; Mossakowski Medical Research Center, Stem Cell Bioengineering Department, Polish Academy of Sciences, Pawinskiego Str., 02-106 Warsaw, Poland., Jornet JM; Department of Electrical Engineering, Northeastern University, Boston, MA 02115, USA., Bae Y; Department of Pathology and Anatomical Sciences, Jacobs School of Medicine and Biomedical Sciences, University at Buffalo, Buffalo, NY 14228, USA., Stachowiak EK; Department of Pathology and Anatomical Sciences, Jacobs School of Medicine and Biomedical Sciences, University at Buffalo, Buffalo, NY 14228, USA., Dutta A; Department of Biomedical Engineering, University at Buffalo, Buffalo, NY 14228, USA.; Institute of Metabolism and Systems Research, Birmingham Research Park, Birmingham B15 2SQ, UK., Stachowiak MK; Department of Pathology and Anatomical Sciences, Jacobs School of Medicine and Biomedical Sciences, University at Buffalo, Buffalo, NY 14228, USA.
Publikováno v:
International journal of molecular sciences [Int J Mol Sci] 2024 May 22; Vol. 25 (11). Date of Electronic Publication: 2024 May 22.
Autor:
Xu J; Center for Nanoscale Materials, Argonne National Laboratory, Lemont, Illinois 60439, USA., Zhong C; Pritzker School of Molecular Engineering, University of Chicago, Chicago, Illinois 60637, USA., Zhuang S; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA., Qian C; Department of Physics and Astronomy, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA., Jiang Y; Department of Electrical and Computer Engineering, Northeastern University, Boston, Massachusetts 02115, USA., Pishehvar A; Department of Electrical and Computer Engineering, Northeastern University, Boston, Massachusetts 02115, USA., Han X; Center for Nanoscale Materials, Argonne National Laboratory, Lemont, Illinois 60439, USA., Jin D; Center for Nanoscale Materials, Argonne National Laboratory, Lemont, Illinois 60439, USA.; Department of Physics and Astronomy, University of Notre Dame, Notre Dame, Indiana 46556, USA., Jornet JM; Department of Electrical and Computer Engineering, Northeastern University, Boston, Massachusetts 02115, USA., Zhen B; Department of Physics and Astronomy, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA., Hu J; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA., Jiang L; Pritzker School of Molecular Engineering, University of Chicago, Chicago, Illinois 60637, USA., Zhang X; Department of Electrical and Computer Engineering, Northeastern University, Boston, Massachusetts 02115, USA.; Department of Physics, Northeastern University, Boston, Massachusetts 02115, USA.
Publikováno v:
Physical review letters [Phys Rev Lett] 2024 Mar 15; Vol. 132 (11), pp. 116701.
Autor:
Crabb J; Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA., Cantos-Roman X; Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA., Aizin G; Kingsborough College, The City University of New York, Brooklyn, NY 11235, USA., Jornet JM; Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA.
Publikováno v:
Nanomaterials (Basel, Switzerland) [Nanomaterials (Basel)] 2023 Dec 11; Vol. 13 (24). Date of Electronic Publication: 2023 Dec 11.
Autor:
Reddy IVAK; Department of Electrical Engineering, University at Buffalo, Buffalo, NY, USA.; Biological and Environmental Science and Engineering Division, King Abdullah University of Science and Technology, Thuwal, Saudi Arabia., Elmaadawy S; Department of Electrical and Computer Engineering, Northeastern University, Boston, MA, USA., Furlani EP; Department of Electrical Engineering, University at Buffalo, Buffalo, NY, USA., Jornet JM; Department of Electrical and Computer Engineering, Northeastern University, Boston, MA, USA. j.jornet@northeastern.edu.
Publikováno v:
Scientific reports [Sci Rep] 2023 Sep 05; Vol. 13 (1), pp. 14643. Date of Electronic Publication: 2023 Sep 05.
Autor:
Jornet JM; Department of Electrical and Computer Engineering, Institute for the Wireless Internet of Things, Northeastern University, 360 Huntington Avenue, Boston, MA, 02115, USA., Knightly EW; Department of Electrical & Computer Engineering, Rice University, 6100 Main St., Houston, TX, 77005, USA., Mittleman DM; School of Engineering, Brown University, 184 Hope St., Providence, RI, 02912, USA. daniel_mittleman@brown.edu.
Publikováno v:
Nature communications [Nat Commun] 2023 Feb 15; Vol. 14 (1), pp. 841. Date of Electronic Publication: 2023 Feb 15.
Autor:
Shrestha R; School of Engineering, Brown University, Providence, RI, 02912, USA. rabi_shrestha@brown.edu., Fang Z; School of Engineering, Brown University, Providence, RI, 02912, USA., Guerboukha H; School of Engineering, Brown University, Providence, RI, 02912, USA., Sen P; Department of Electrical and Computer Engineering, Northeastern University, 360 Huntington Ave, Boston, MA, 02115, USA., Hernandez-Cardoso GG; Department of Physics, Philipps-Universität Marburg, Renthof 5, 35032, Marburg, Germany., Castro-Camus E; Department of Physics, Philipps-Universität Marburg, Renthof 5, 35032, Marburg, Germany., Jornet JM; Department of Electrical and Computer Engineering, Northeastern University, 360 Huntington Ave, Boston, MA, 02115, USA., Mittleman DM; School of Engineering, Brown University, Providence, RI, 02912, USA.
Publikováno v:
Scientific reports [Sci Rep] 2022 Jun 29; Vol. 12 (1), pp. 10971. Date of Electronic Publication: 2022 Jun 29.