Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Joost Van Kerkhof"'
Autor:
Wout Knoben, Siegfried Graf, Florian Borutta, Zerihun Tegegne, Michael Ningler, Arthur Blom, Henk Dam, Kevin Evers, Rens Schonenberg, Anke Schütz-Trilling, Janneke Veerbeek, Roman Arnet, Mark Fretz, Vincent Revol, Thomas Valentin, Christopher R. Bridges, Stephan K. Schulz, Joost van Kerkhof, Anne Leenstra, Farid Orujov, Henk van Middendorp
Publikováno v:
Sensors, Vol 24, Iss 16, p 5241 (2024)
Aquaculture is expected to play a vital role in solving the challenge of sustainably providing the growing world population with healthy and nutritious food. Pathogen outbreaks are a major risk for the sector, so early detection and a timely response
Externí odkaz:
https://doaj.org/article/2d04b54e199e4ca49b8379887eac697f
Autor:
Wenjing Tian, Lucas Beste, Alexander Khachikyan, Christoph Mittelstädt, Ronald Dekker, Kerstin Wörhoff, Joost Van Kerkhof, Rui Santos, Kevin Williams, Xaveer Leijtens
Publikováno v:
IEEE Journal of Quantum Electronics, 59(3):9963964. Institute of Electrical and Electronics Engineers
In this paper, we present a flip-chip bonding concept for InP die on SiN-based TriPleX carrier using laser soldering. The InP die and SiN-based TriPleX carrier include the metalization patterns for commonly used photonic integrated circuit reference
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2ae1b31338126dc0ff9fc8e6d25b6045
https://research.tue.nl/nl/publications/28310461-78fb-4db5-b69a-5aaf0c6036cb
https://research.tue.nl/nl/publications/28310461-78fb-4db5-b69a-5aaf0c6036cb
Autor:
Cornelis Franken, Ward Hendriks, Meindert Dijkstra, Adriano do Nascimento, Lisa Winkler, Albert van Rees, Soheila Mardani, Ronald Dekker, Joost van Kerkhof, Peter van der Slot, Sonia García-Blanco, Klaus-J. Boller
Publikováno v:
Integrated Optics: Devices, Materials, and Technologies XXVII, 12424
Hybrid integrated diode lasers offer a robust and small-sized solution for applications in telecommunications, quantum optics and metrology due to their wide tunability and ultra-narrow linewidth. Here, we present the fabrication, packaging and succe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::232a6f19e319cdc7a1dbd927a763a0f8
https://doi.org/10.1117/12.2657253
https://doi.org/10.1117/12.2657253
Autor:
Bradley W. Snyder, Zerihun G. Tegegne, Nienke Nijenhuis, Tianwen Qian, David de Felipe, Simon Nellen, Milan Deumer, Y. Durvasa Gupta, Moritz Baier, Björn Globisch, Norbert Keil, Joost Van Kerkhof
Publikováno v:
Photonics West 2022
Optical Interconnects XXII
Optical Interconnects XXII
We describe the assembly of a 5G transceiver leveraging photonics for the generation, emission and detection of THz wireless signals. The transceiver and all associated control electronics and power supplies are designed for mounting in a mobile aeri
Publikováno v:
Sensors and Actuators B: Chemical
Photonic Integrated Circuit technology for visible light can enable new applications which are not possible to realize with existing discrete components. In this paper we will show several examples of passive and active optical functions based on our
Autor:
Edwin J. Klein, Jeremy Witzens, Sebastian Romero-García, Martin Büscher, Joost van Kerkhof, Thomas Klos, Jonas Leuermann, Douwe Geuzebroek, Jürgen Krieg, Patrick Leisching
Publikováno v:
Silicon Photonics XII.
Photonic Integrated Circuits (PIC) will change the fundamental paradigms for the design of multi-color laser engines for life sciences. Exemplified with flow cytometry (FCM), integrated optical technology for visible wavelengths will be shown to open
Publikováno v:
32nd European Mask and Lithography Conference.
Photonic technology is increasingly used in applications in medicine, life and environmental science. Whereas currently many of these applications are implemented using some form of discrete (free-space) optics, much can be gained from a transition t
Autor:
Wenjing Tian, Kerstin Wörhoff, Ronald Dekker, Alexander Khachikyan, Christoph Mittelstädt, Joost van Kerkhof, Yizhen Ren, Santos, R., Williams, Kevin A., Xaveer Leijtens
Publikováno v:
Pure TUe
25th Annual Symposium of the IEEE Photonics Society Benelux
25th Annual Symposium of the IEEE Photonics Society Benelux
Scalable and cost-effectively connecting optical inputs and outputs to photonic integrated circuits (PICs) is challenging in photonic assembly. We utilize a TriPleX (SiN) interposer with suspended waveguides for interfacing optical fiber arrays to wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::d202cd296db8d0f2848f360933280205
https://research.tue.nl/en/publications/05aac9b1-bc40-43a3-b073-b5ec8979f46a
https://research.tue.nl/en/publications/05aac9b1-bc40-43a3-b073-b5ec8979f46a
Autor:
Wenjing Tian, Lucas Beste, Alexander Khachikyan, Christoph Mittelstädt, Ronald Dekker, Kerstin Wörhoff, Joost van Kerkhof, Rui Santos, Kevin Williams, Xaveer Leijtens
Publikováno v:
Pure TUe
Proceedings 2022 23rd European Conference on Integrated Optics (ECIO), 71-73
STARTPAGE=71;ENDPAGE=73;TITLE=Proceedings 2022 23rd European Conference on Integrated Optics (ECIO)
Proceedings 2022 23rd European Conference on Integrated Optics (ECIO), 71-73
STARTPAGE=71;ENDPAGE=73;TITLE=Proceedings 2022 23rd European Conference on Integrated Optics (ECIO)
We present a photonic flip-chip assembly for a 4 mm × 4.6 mm InP die with 58 electrical connections on a 16 mm × 8 mm TriPleX die by using laser soldering. Two laser soldering schemes are investigated and show reliable contacts with a 6 N shear for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::6a6b3547abe8dea198aba46f1f937fe4
https://research.tue.nl/en/publications/06f9fc7e-10cf-4b6d-b7cc-3fa434264392
https://research.tue.nl/en/publications/06f9fc7e-10cf-4b6d-b7cc-3fa434264392