Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Joo Young Chung"'
Publikováno v:
BioTechniques, Vol 29, Iss 4, Pp 768-774 (2000)
To facilitate the establishment of recombinant Chinese hamster ovary (rCHO) cell lines with dihydrofolate reductase (dhfr)-mediated gene amplification, a primary selection method based on morphology of parental CHO clones has been developed. Morpholo
Externí odkaz:
https://doaj.org/article/8a72b3c8f58e4d3ab6028a8196e99967
Autor:
Jungno Lee, Joo-Young Chung
Publikováno v:
Korean Society of Technical Education and Training. 25:63-68
Autor:
Jeong-Soo Lee, Jong-Chan Kim, Joo-Young Chung, Seong-Wook Hong, Kil-Hwan Choi, Young-Lan Kwak
Publikováno v:
Korean Journal of Anesthesiology, Vol 58, Iss 2, Pp 122-128 (2010)
BackgroundValvular heart surgery (VHS) utilizing cardiopulmonary bypass (CPB) is inevitably associated with ischemic-reperfusion injury, which is known to depend on oxygen tension during reperfusion. The aim of this study was to evaluate the effect o
Externí odkaz:
https://doaj.org/article/2795c7af122542e38d3fabbcdc59d37f
Publikováno v:
Korean Journal of Anesthesiology, Vol 58, Iss 5, Pp 477-479 (2010)
A 12-year-old boy with ventricular septal defect and patent ductus arteriosus was presented to the operating room. Upon clamping the patent ductus arteriosus, the femoral arterial pressure curve was lost; however, it returned upon unclamping. Upon fu
Externí odkaz:
https://doaj.org/article/f9735d0c68d04e578505d6bf817f1e09
Autor:
Ju-Hun Park, Hyen Kyu Choi, Byoung Hark Park, Mi Young Choi, Gahyun Kim, Joo-Young Chung, Jong-Sool Kim
Publikováno v:
Anesthesia and Pain Medicine. 12:240-242
Publikováno v:
2018 China Semiconductor Technology International Conference (CSTIC).
The recent interest of Fan-out wafer level packaging technology (FOWLP) comes from such benefits, thin package, board fan-out capability, high I/O, good thermal resistance, and electrical performance. However, its application is limited due to the di
Autor:
Joo-Young Chung1, Gahyun Kim1 tokimga@gmail.com, Ju-Hun Park1, Hyen Kyu Choi1, Byoung Hark Park1, Mi Young Choi1, Jong-Sool Kim1
Publikováno v:
Anesthesia & Pain Medicine. Jul2017, Vol. 12 Issue 3, p240-242. 3p.
Autor:
Junghwa Kim, Sang-Kyun Kim, Lee Dong-Hwan, Yoonman Lee, Kyunghag Jung, Joo Young Chung, Park Yong-Yeop, Kihyeok Kwon
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Fan-out wafer level packaging technology (FOWLP) is one of the advanced packages in semiconductor industry. Recently, its interest has been raised due to the benefits such as thin package, board fan-out capability, high I/O, substrate-less process, i
Publikováno v:
KIPS Transactions on Software and Data Engineering. 3:187-194
Autor:
Seong Wook Hong, Young Lan Kwak, Joo Young Chung, Jong Chan Kim, Kil Hwan Choi, Jeong Soo Lee
Publikováno v:
Korean Journal of Anesthesiology, Vol 58, Iss 2, Pp 122-128 (2010)
Korean Journal of Anesthesiology
Korean Journal of Anesthesiology
Background: Valvular heart surgery (VHS) utilizing cardiopulmonary bypass (CPB) is inevitably associated with ischemic-reperfusion injury, which is known to depend on oxygen tension during reperfusion. The aim of this study was to evaluate the effect