Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Jongin Ryu"'
Publikováno v:
IEEE Access, Vol 12, Pp 146359-146365 (2024)
The deployment of Ka-band radar necessitates addressing increased losses due to rain and free-space propagation, in addition to achieving low sidelobe levels (SLL). Substrate integrated waveguide (SIW) slot antennas, with their high-power handling ca
Externí odkaz:
https://doaj.org/article/a61c6a87502d4372b66418cbd7140a3d
Publikováno v:
IEEE Access, Vol 11, Pp 125519-125528 (2023)
In this work, we present a compact four-direction beamforming 5G antenna based on a stacked $4\times4$ Butler matrix and a microstrip patch array antenna. The proposed beamforming antenna is a stacked-up structure using the low temperature co-fired c
Externí odkaz:
https://doaj.org/article/08501af640d24037ba2b1ebb7b2299e2
Publikováno v:
Journal of Electromagnetic Engineering and Science, Vol 22, Iss 4, Pp 452-458 (2022)
This paper introduces a miniaturized Butler matrix design method using a folded structure. The Butler matrix was fabricated in multi-layers using low-temperature co-fired ceramics (LTCC) and designed to operate at 28 GHz. The conventional one-plane B
Externí odkaz:
https://doaj.org/article/7f38fd57fc5d46bb8899deb06ea3b5a3
Publikováno v:
The Journal of Korean Institute of Electromagnetic Engineering and Science. 32:51-55
Publikováno v:
2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting.
This paper proposes a tapered slot antenna with band-stop characteristic at Ka-band. In order to create a 28 GHz stopband and reduce sidelobes, SRRs are added on the feedline and corrugations are formed on both sides of the antenna. Through these str
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Work on the Pulse Laser Deposition (PLD) equipment is purely for research and development at Samsung Electro-Mechanics when it takes 30 minutes to complete the experiment to grow a dielectric thin film on Cu plated pieces of Si wafer. At SEMCO, low t
Publikováno v:
2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT); 2008, p1-4, 4p