Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Jonghyun Chae"'
Publikováno v:
Fluids, Vol 9, Iss 9, p 216 (2024)
A comprehensive review of recent advancements in applying deep reinforcement learning (DRL) to fluid dynamics problems is presented. Applications in flow control and shape optimization, the primary fields where DRL is currently utilized, are thorough
Externí odkaz:
https://doaj.org/article/b606945a2eef4865931b7f564e10b067
Publikováno v:
Energies, Vol 12, Iss 18, p 3506 (2019)
The solar updraft tower (SUT) is a renewable power generation system that uses natural air convection from the ground that is heated by solar radiation. Placing flow-guide structures within the collector of the SUT can enhance aerodynamic performance
Externí odkaz:
https://doaj.org/article/f1dbea1351814b97b411c4bb33e807c4
Autor:
Min Seok Kang, Incheol Heo, Sangyeop Kim, Jihye Yang, Jangbae Kim, Sun-Joon Min, Jonghyun Chae, Won Cheol Yoo
Publikováno v:
Energy Storage Materials. 50:234-242
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4ce12e730ce0d38428e374d0d262705
https://doi.org/10.1016/j.ensm.2022.05.025
https://doi.org/10.1016/j.ensm.2022.05.025
Autor:
Sangheon Lee, Jiwon Yu, Myungsuk Lee, Jonghyun Chae, Hyung-Kyu Lim, Yeonseo Kim, Gyeong S. Hwang
Publikováno v:
Journal of Power Sources. 505:229917
Low-temperature activation of lithium-ion migration is crucial for enabling the practical application of solid-state polymer electrolytes for lithium-ion batteries. In this study, we perform a series of first-principle calculations and demonstrate th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e3b4e4fb870ecba97df169750a19365
https://doi.org/10.1016/j.jpowsour.2021.229917
https://doi.org/10.1016/j.jpowsour.2021.229917
Publikováno v:
Energies
Volume 12
Issue 18
Energies, Vol 12, Iss 18, p 3506 (2019)
Volume 12
Issue 18
Energies, Vol 12, Iss 18, p 3506 (2019)
The solar updraft tower (SUT) is a renewable power generation system that uses natural air convection from the ground that is heated by solar radiation. Placing flow-guide structures within the collector of the SUT can enhance aerodynamic performance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6d5ddad0388c7916230e7d77fe4dd5d8
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Dual-Interface FSID COB (Chip-On-Board) product has been widely applied in banking card. In order to verifying its mechanical performance, there is a 3Wheel test to simulate banking cards use in ATM machine. At present, the specification of 3Wheel is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe27d742102556a0be34188a17bfd58d
https://doi.org/10.1109/icept.2018.8480627
https://doi.org/10.1109/icept.2018.8480627
Publikováno v:
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
in this paper, a COB (chip on board) 3wheel test simulation method for assessment banking card bending performance was fully studied and developed. To achieve high precision prediction, the dynamic 3 wheel test is divided into series of static analys
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2803e45c9e2c0adc574a7c17a8825349
https://doi.org/10.1109/icept.2017.8046492
https://doi.org/10.1109/icept.2017.8046492
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
In this paper, the root cause and solution of bump deformation failure of memory product in FC(Flip chip) process were studied through experimental and simulation method. After analysis, MUF (Mold under fill) unbalanced flow was proposed to be the re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7258b95bf7ce65e62a5881330110d25
https://doi.org/10.1109/icept.2016.7583330
https://doi.org/10.1109/icept.2016.7583330
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
In this paper, the stress distribution and weak point of Au bonding wire in Chip-On-Board (COB) package were analyzed via a stress released model. In order to find out root cause and factors of it, simulations were performed to explain TC failure mec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d2af56c5a69a2f59caf7181a7dd3794
https://doi.org/10.1109/icept.2016.7583332
https://doi.org/10.1109/icept.2016.7583332
Autor:
Senyun Kim, Qiang Chen, Myungkee Chung, Zhenqing Zhao, Maohua Du, Hai Liu, Jianwei Zhou, Jonghyun Chae
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
Copper wire bonding is being developed rapidly in recent years to replace expensive gold wire for electronic packaging. However, one issue about reliability in humidity environment causes risk in its application. The copper wire-aluminum pad interfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad900eeac8dd38c0a72d8eabd8bf3179
https://doi.org/10.1109/eptc.2011.6184385
https://doi.org/10.1109/eptc.2011.6184385