Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Jongchan Yoon"'
Publikováno v:
Carbon. 196:236-242
Autor:
Jae Youl Cho, Jaehyeon Hwang, Tae-Kyung Han, Ju Ah Yoo, Jongchan Yoon, Hyungkee Yoon, Jongsung Lee, Seoljun An
Publikováno v:
Biomolecules & Therapeutics
Adipose tissue secretes many adipokines which contribute to various metabolic processes, such as blood pressure, glucose homeostasis, inflammation and angiogenesis. The biology of adipose tissue in an obese individual is abnormally altered in a manne
Publikováno v:
ACS Applied Materials & Interfaces. 12:22029-22036
The electronic, catalytic, and optical properties of transition metal dichalcogenides (TMDs) are significantly affected by oxidation, and using oxidation to tune the properties of TMDs has been actively explored. In particular, because transition met
Autor:
Injoon Son, Sanghum Cho, Jongchan Yoon, Kyung Tae Kim, Sung Hwa Bae, KwanHo Park, Ho-Sang Sohn
Publikováno v:
Journal of Nanoscience and Nanotechnology. 19:1738-1742
A method for directly bonding thermoelectric elements onto copper electrodes without applying a solder paste was developed in this study. A tin coating of thickness approximately 50 μm was deposited via electroplating onto the surface of a Bi₂Te
Publikováno v:
ACS applied materialsinterfaces. 12(19)
The electronic, catalytic, and optical properties of transition metal dichalcogenides (TMDs) are significantly affected by oxidation, and using oxidation to tune the properties of TMDs has been actively explored. In particular, because transition met
Publikováno v:
Journal of Nanoscience and Nanotechnology. 18:6515-6519
In this study, we devised a method to bond thermoelectric elements directly to copper electrodes by plating indium with a relatively low melting point. A coating of indium, ~30 μm in thickness, was fabricated by electroplating the surface of a Bi2Te
Autor:
Jongchan Yoon, Zonghoon Lee
Publikováno v:
Applied Microscopy. 47:176-186
Autor:
Jongchan, Yoon, Sung Hwa, Bae, Ho-Sang, Sohn, Injoon, Son, KwanHo, Park, Sanghum, Cho, Kyung Tae, Kim
Publikováno v:
Journal of nanoscience and nanotechnology. 19(3)
A method for directly bonding thermoelectric elements onto copper electrodes without applying a solder paste was developed in this study. A tin coating of thickness approximately 50
Publikováno v:
Journal of nanoscience and nanotechnology. 18(9)
In this study, we devised a method to bond thermoelectric elements directly to copper electrodes by plating indium with a relatively low melting point. A coating of indium, ~30 μm in thickness, was fabricated by electroplating the surface of a Bi2Te