Zobrazeno 1 - 10
of 109
pro vyhledávání: '"Jong-Tae Moon"'
Publikováno v:
Beilstein Journal of Nanotechnology, Vol 9, Iss 1, Pp 1715-1727 (2018)
This study reports on the controllable synthesis of uniform colloidal titanium dioxide (TiO2) particles and their photocatalytic applications toward rhodamine B (RhB) degradation. The monodispersed TiO2 particles were synthesized under mixed solvent
Externí odkaz:
https://doaj.org/article/193819cea2a642ee94b87cb72641179c
Autor:
Jungsoo Kim, Jiyoon Kim, Saeul Jeong, Minhyun Kim, Sanghyeok Park, Jong Tae Moon, Kwang-Deog Moon
Publikováno v:
Korean Journal of Food Preservation. 29:129-141
Despite the high intake convenience and functionality of Actinidia arguta, its practical utilization remains limited; therefore, the development of new products is necessary to increase the industrial significance of Actinidia arguta. Also, as the ve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94bb900b53cd5882b5b8365cdcdd2a96
https://doi.org/10.11002/kjfp.2022.29.1.129
https://doi.org/10.11002/kjfp.2022.29.1.129
Publikováno v:
Journal of Industrial and Engineering Chemistry. 73:328-335
Developing techniques for monitoring and removing organic pollutants such as solvents and dyes in environmental media is a very important task nowadays. To get rid of the pollutants, efficient materials that can sorb, detect, and decompose such compo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9c1b85c14b2825874b5b959fed9d1fc
https://doi.org/10.1016/j.jiec.2019.02.001
https://doi.org/10.1016/j.jiec.2019.02.001
Publikováno v:
Beilstein Journal of Nanotechnology, Vol 9, Iss 1, Pp 1715-1727 (2018)
This study reports on the controllable synthesis of uniform colloidal titanium dioxide (TiO2) particles and their photocatalytic applications toward rhodamine B (RhB) degradation. The monodispersed TiO2 particles were synthesized under mixed solvent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::12c7741debbd4714d80ea6540bb809bc
https://doaj.org/article/193819cea2a642ee94b87cb72641179c
https://doaj.org/article/193819cea2a642ee94b87cb72641179c
Publikováno v:
Microelectronics Reliability. 71:41-50
The effects of the material properties of the underfill layer on thermal stress and deformation in 3D through silicon via (TSV) integration packages were evaluated through numerical analysis. Sample TSV packages with underfill composed of different s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9280f76f73df767af41dee403a89f292
https://doi.org/10.1016/j.microrel.2017.02.010
https://doi.org/10.1016/j.microrel.2017.02.010
Publikováno v:
Catalysts
Volume 9
Issue 6
Catalysts, Vol 9, Iss 6, p 491 (2019)
Volume 9
Issue 6
Catalysts, Vol 9, Iss 6, p 491 (2019)
One of the most important issues in photocatalysis research has been the development of TiO2-based photocatalysts that work efficiently under visible light conditions. Here, we report the monodispersed, spherical TiO2 particles with disordered rutile
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2c3ec9c091b42124f96de24d0267454e
Publikováno v:
Journal of Welding and Joining. 33:32-39
Epoxy solder paste and its applications Jong-Tae Moon*, Yong-Sung Eom** and Jong-Hyun Lee***,† *Hojeonable, Inc. Daejeon 305-510, Korea **Energy Transfer Device Lab., Electronics and Telecommunications Research Institute (ETRI), Daejeon 305-700, Ko
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0f0ec839374756817db02d89b2583dc
https://doi.org/10.5781/jwj.2015.33.3.32
https://doi.org/10.5781/jwj.2015.33.3.32
Autor:
Jong-Tae Moon, Tae-Sung Oh, Jeong-Yeol Choi, Ji-Hye Son, Hyun-Cheol Bae, Kwang-Seong Choi, Haksun Lee, Yong-Sung Eom
Publikováno v:
Journal of the Microelectronics and Packaging Society. 22:51-54
An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aba810f6680edf128bf07856317a61ba
https://doi.org/10.6117/kmeps.2015.22.1.051
https://doi.org/10.6117/kmeps.2015.22.1.051
Publikováno v:
Journal of the Microelectronics and Packaging Society. 21:51-56
Department of Materials Science & Engineering, Seoul National University of Science & Technology,232 Gongneung-ro, Nowon-gu, Seoul 139-743, Korea(2014년 12월 5일 접수: 2014년 12월 17일 수정: 2014년 12월 22일 게재확정 )초록:가격
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af3827592f9be37d29c3940d0654504f
https://doi.org/10.6117/kmeps.2014.21.4.051
https://doi.org/10.6117/kmeps.2014.21.4.051
Publikováno v:
ETRI Journal. 33:864-870
As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f6c8bcac9f3eadf6013fe1e610d2783
https://doi.org/10.4218/etrij.11.0110.0520
https://doi.org/10.4218/etrij.11.0110.0520