Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Jong-Son Lyu"'
Publikováno v:
ETRI Journal. 20:241-250
The structure and electrical characteristics of metal-ferroelectric-semiconductor FET(MFSFET) for a single transistor memory are presented. The MFSFET was comprised of polysilicon islands as source/drain electrodes and film as a gate dielectric. The
Publikováno v:
IEEE Transactions on Electron Devices. 45:2153-2160
The effects of a buffer layer structure on polysilicon buffered LOCOS were shown and analyzed. Sample wafers are classified into four groups to show the effect of the buffer layer structure. The structures of the four different buffer layers are mono
Publikováno v:
ETRI Journal. 17:1-12
A novel body-tied silicon-on-insulator(SOI) n-channel metal-oxide-semiconductor field-effect transistor with grounded body electrode named GBSOI nMOSFET has been developed by wafer bonding and etch-back technology. It has no floating body effect such
Publikováno v:
IEEE Transactions on Electron Devices. 41:726-733
An analytical model for SOI nMOSFET with a floating body is developed to describe the I/sub ds/-V/sub ds/ characteristics. Considering all current components in MOSFET as well as parasitic BJT, this study evaluates body potential, investigates the co
Autor:
Jong-Son Lyu
Publikováno v:
ETRI Journal. 15:10-25
Interface trap densities at gate oxide/silicon substrate () interfaces of metal oxide semiconductor field-effect transistors (MOSFETs) were determined from the substrate bias dependence of the subthreshold slope measurement. This method enables the c
Publikováno v:
IEEE Electron Device Letters. 17:109-111
Advanced bipolar transistors used for high speed integrated circuits tend to drive high current density. As a result, base-widening occurs and device performance degrades. One of the methods to alleviate the base-widening is to form retrograde collec
Publikováno v:
IEEE Electron Device Letters. 16:236-238
Leakage current through the parasitic channel formed at the sidewall of the SOI active region has been investigated by measuring the subthreshold I-V characteristics. Partially depleted (PD, /spl sim/2500 /spl Aring/) and fully depleted (FD, /spl sim
Publikováno v:
Proceedings of 1993 IEEE International SOI Conference.
N-channel SOI MOSFET was fabricated by using the silicon direct bonding (SDB) technology, where its body was tied with a grounded p/sup +/ polysilicon for eliminating the substrate floating effect. Fabricated SOI MOSFETs show no kinks on their drain
Publikováno v:
International Electron Devices Meeting. Technical Digest.
The structure and electrical characteristics of a metal-ferroelectric-semiconductor field-effect transistor (MFSFET) for a single transistor memory are presented. We developed a novel MFSFET with polysilicon islands as source/drain electrodes and a B
Publikováno v:
1996 IEEE International SOI Conference Proceedings.
We developed a new SOI device with a self-aligned polysilicon gate on the recessed channel region and obtained low source/drain resistance, symmetrical I/sub D/-V/sub DS/ characteristics and high breakdown voltage (BV/sub DSS/). The self-alignment wa