Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Jong pa Hong"'
Autor:
Jong Pa Hong, Su Chang Lee, Sun Woo Han, Sang Kun Oh, Sang Sik Park, Hyeong Mun Kang, Won Keun Kim, Kil Soo Kim, Dan Oh
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed51171a6014879b7d920ad93bdc51d1
https://doi.org/10.1109/ectc51906.2022.00088
https://doi.org/10.1109/ectc51906.2022.00088
Autor:
Jong Pa Hong, Su Chang Lee, Soohyun Nam, Sun woo Han, Park Yu-Kyung, Jongho Lee, Sang kun O, Dong Ok Kwak
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
2.5D IC packages are typically produced through Chip on Wafer (CoW) or Chip on Substrate (CoS) processes. Among these, 2.5D processing involves bonding the interposer chip and ASIC chip perpendicularly in sequence to the substrate for 2.5D package pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f762aa2b6486a8430d3507ea7cbc8279
https://doi.org/10.1109/ectc32696.2021.00242
https://doi.org/10.1109/ectc32696.2021.00242
Autor:
Jong Pa Hong, Joo Youl Huh
Publikováno v:
Solid State Phenomena. 118:405-412
An explicit, finite difference scheme was used to examine the effects of coherency stresses and interface kinetic barriers on the phase evolution of a binary, thin-film diffusion couple. Thin-films, initially consisting of alternating layers of two t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af28262a9ba74be2d77970d7cc18b005
https://doi.org/10.4028/www.scientific.net/ssp.118.405
https://doi.org/10.4028/www.scientific.net/ssp.118.405
Publikováno v:
SPIE Proceedings.
Molecular-mechanics based simulations are applied to investigate the structures and phase stability of InGaN alloys. The variation of bond lengths and angles with increasing In composition is found. This causes the considerable structural change and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f4715619e2f23d04cf5b7a34043c9f8
https://doi.org/10.1117/12.675674
https://doi.org/10.1117/12.675674