Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Jong Hwan Ha"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:127-134
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9de5e26137141e8bebd0dae57f654781
https://doi.org/10.1109/tcpmt.2023.3239304
https://doi.org/10.1109/tcpmt.2023.3239304
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:161-168
An energy-based 3-D model was created to simulate the solder joint formation of the chip capacitor during reflow. The surface tension ( $F_{s}$ ) and hydrostatic force ( $F_{h}$ ) of molten solder and the gravitational force ( $F_{g}$ ) of a chip cap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e483ef057d1022576082a738ad45b870
https://doi.org/10.1109/tcpmt.2020.3034211
https://doi.org/10.1109/tcpmt.2020.3034211
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In the surface mount technology (SMT), the pick and place process of the passive components such as capacitors and resistors may induce systematic misplacement because of the various environmental factors in the manufacturing. Particularly, in the re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9db96e2a5c33cfac454fe233f517873d
https://doi.org/10.1109/itherm45881.2020.9190328
https://doi.org/10.1109/itherm45881.2020.9190328
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this study, an energy-based three-dimensional (3D) model is created using Surface Evolver to predict the passive components solder joint shape after reflow soldering. The developed model considers the surface tension and hydrostatic forces on the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82530c8b92df957ccb3d0a2d9f69df8a
https://doi.org/10.1109/ectc32862.2020.00204
https://doi.org/10.1109/ectc32862.2020.00204
Publikováno v:
Procedia Manufacturing. 38:1372-1380
The solder joint topology plays a significant role in determining its fatigue life. Due to the complex nature of the actual manufacturing environment, there are variations in solder volume for each joint, which can induce the solder shape variations
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbabd05aedd431bf5a424864088d7fe9
https://doi.org/10.1016/j.promfg.2020.01.151
https://doi.org/10.1016/j.promfg.2020.01.151
Publikováno v:
Procedia Manufacturing. 38:1381-1393
In surface mount assembly, the consistency of solder paste volumes and the placement of the components play a vital role in the movement of the chip components when they go through the reflow soldering process. These movements may lead to common asse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74f2df129c40c15d21dbdc530c6493d9
https://doi.org/10.1016/j.promfg.2020.01.150
https://doi.org/10.1016/j.promfg.2020.01.150