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pro vyhledávání: '"Jon Mellen"'
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Traditional laser scribe which utilizes a nanosecond laser to ablate metal and interlayer dielectric layers (ILD) has been widely adopted by the microelectronics packaging industry as the gold standard for laser scribe processing in die prep singulat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::878f0040643b7bec3275cffb54c233df
https://doi.org/10.1109/ectc.2019.00075
https://doi.org/10.1109/ectc.2019.00075
