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Autor:
Yoshihiro Tsutsumi, Ho Soon Wee, Venky Sundaram, Lee Wen Sheng Vincent, V. Kripesh, Myo Eipa, Johnson Kek Navas Khan, H S Chua, Srinivas Vempati, L C Yew
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
Wafer thinning has been an important topic in the semiconductor industry. The trend in microelectronic industry is getting thinner and smaller packages. During the process of wafer thinning and sawing, die cracks and thus leading to failures. This pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e478c9a2b01f7a6258f4fcbc8c2227aa
https://doi.org/10.1109/eptc.2009.5416415
https://doi.org/10.1109/eptc.2009.5416415
