Zobrazeno 1 - 4
of 4
pro vyhledávání: '"John Wing-Keung Lau"'
Publikováno v:
Journal of the American Ceramic Society. 74:2214-2219
Polycrystalline AIN bodies were made with a range of porosities from various AIN powders by sintering or hot-pressing. Thermal conductivity data for material produced without sintering aids showed a gradual, yet definite, porosity dependence with sca
Autor:
John Wing-Keung Lau, M.R. Ehlert, E. Y. Luh, Leonard E. Dolhert, Jack Harrison Enloe, A.L. Kovacs
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 14:538-542
A program to produce large cofired aluminum nitride (AIN) packages for support of silicon-based high-density multichip modules (MCMs) is discussed. Perimeter leaded packages measuring over 4 in in length and having over 600 leads on 0.025-in centers
Publikováno v:
MRS Proceedings. 226
Silver-glass die attach adhesives provide a cost effective means of producing high reliability parts which can withstand the environmental testing required of electronic components. One step processing of these adhesives provides the additional advan
Autor:
Jacob Block, Semyon D. Friedman, Rast Brezny, Ernest W Hughes, Awdhoot V. Kerkar, John Wing-Keung Lau
Publikováno v:
Journal of Molecular Catalysis A: Chemical. 125:153