Zobrazeno 1 - 4
of 4
pro vyhledávání: '"John R. Pennacchia"'
Autor:
Hai P. Longworth, M.P. Jeanneret, Eric D. Perfecto, John R. Pennacchia, R.R. Shields, Ajay P. Giri
Publikováno v:
IBM Journal of Research and Development. 42:597-606
A new generation of multilevel thin-film packages has been developed for IBM high-end S/390® and AS/400® systems. Thin-film structures in these packages are nonplanar and can be fabricated by either pattern electroplating or subtractive etching. Se
Publikováno v:
Proceedings 1997 International Conference on Multichip Modules.
A family of high performance MCM-C/D packages which are used in the new IBM S390 Enterprise G3 and Multiprise systems is described. The packages are constructed of a shielded thin film redistribution structure on a multilayer cofired alumina/molybden
Publikováno v:
Macromolecules. 19:973-977
Synthese de poly (hydroxy-1 phenylene-2,6) methylenes et du derive t-butyl. Determination de l'energie de dissociation de la liaison hydrogene par spectrometrie FTIR
Publikováno v:
Macromolecules. 20:1174-1176