Zobrazeno 1 - 6
of 6
pro vyhledávání: '"John P. Koppes"'
A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties
Autor:
Pylin Sarobol, John E. Blendell, Ying Wang, Wei-Hsun Chen, Aaron E. Pedigo, Carol A. Handwerker, John P. Koppes
Publikováno v:
Mitigating Tin Whisker Risks
Whisker and hillock formation in thin films is well known as a highly local mechanism for stress relaxation, where in many cases, only a few whiskers form out of thousands of grains in a film. In this article, the microstructural characteristics for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::879895149fd1c3079bbc1dbf8de0a7e0
https://doi.org/10.1007/s11837-013-0717-x
https://doi.org/10.1007/s11837-013-0717-x
Publikováno v:
Materials Letters. 99:76-80
Direct evidence was obtained for the nucleation of surface grains through recrystallization and their growth into whiskers and hillocks during thermal cycling of Sn-alloy films. Shallow grains with low dislocation densities nucleated at pre-existing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5f79904e5ff3b51350e1c53e8ae6f2a
https://doi.org/10.1016/j.matlet.2013.02.066
https://doi.org/10.1016/j.matlet.2013.02.066
A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties
Autor:
Pylin Sarobol, Ying Wang, Wei-Hsun Chen, Aaron E. Pedigo, John P. Koppes, John E. Blendell, Carol A. Handwerker
Publikováno v:
Mitigating Tin Whisker Risks ISBN: 9781119011965
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dde9f4dc4a5945261b35babf6f72252d
https://doi.org/10.1002/9781119011965.ch1
https://doi.org/10.1002/9781119011965.ch1
Autor:
Carol A. Handwerker, S. Sengupta, Rao Revur, John P. Koppes, Anthony R. Muza, Alan Rae, Eric A. Stach, Kevin A. Grossklaus
Publikováno v:
Materials Science and Engineering: B. 177:197-204
Development of a Pb-free Sn nanosolder paste with an initial melting temperature near or below the melting temperature of eutectic Sn–Pb solder (183 °C) has been investigated using the size-dependent melting behavior of small particles. Three to f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2316a7d9f64164e69ef3e9f21737446b
https://doi.org/10.1016/j.mseb.2011.12.019
https://doi.org/10.1016/j.mseb.2011.12.019
Comment on 'Size-Dependent Melting Properties of Small Tin Particles: Nanocalorimetric Measurements'
Publikováno v:
Physical Review Letters. 104
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f29053968d5041c2104cfa43897f6e9a
https://doi.org/10.1103/physrevlett.104.189601
https://doi.org/10.1103/physrevlett.104.189601
Autor:
Carol A. Handwerker, Pylin Sarobol, John E. Blendell, Aaron E. Pedigo, W Chen, Y Wang, P Su, John P. Koppes
Publikováno v:
Microscopy and Microanalysis. 17:1846-1847
Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::802dd1b0d05726b64266d5fa88a95a92
https://doi.org/10.1017/s1431927611010105
https://doi.org/10.1017/s1431927611010105