Zobrazeno 1 - 3
of 3
pro vyhledávání: '"John P. Cincotta"'
Autor:
Thomas A. Wassick, John P. Cincotta, Oswaldo Chacon, Theo Anemikos, Hugues Gagnon, Robert Martel, Charles Carey, Samantha Donavan, Zhuo-Jie Wu, Patrick Justison, Doug Hunt
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
To enable higher computing power in a single chip, there is demand for increasing die size for high performance applications in advanced nodes. Due to the weak mechanical properties of the low-k and ultra low-k (ULK) dielectrics in advanced technolog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::827d306934b3c59182bc6a6e98937ffe
https://doi.org/10.1109/ectc.2018.00104
https://doi.org/10.1109/ectc.2018.00104
Autor:
Robin A. Susko, Wolfgang Sauter, Thomas A. Wassick, Timothy H. Daubenspeck, Timothy D. Sullivan, John P. Cincotta
Publikováno v:
ECS Transactions. 16:51-60
Understanding and managing both chip-to-package interaction (CPI) and solder bump electromigration (EM) in new designs is becoming an increasing challenge for flip chip plastic ball grid array (FCPBGA) packaging. Requirements for state-of-the-art dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::042e31b5ac27d968de46ab32a50020f1
https://doi.org/10.1149/1.3114551
https://doi.org/10.1149/1.3114551
Autor:
Karen P. McLaughlin, David Turnbull, Chris Muzzy, Naftali E. Lustig, Danielle Degraw, Richard Bisson, Jason Gill, John P. Cincotta, Sylvain Ouimet, Joseph C. Ross, Edward Engbrecht
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
A review of the chip-to-package interaction (CPI) results during the development and qualification of IBM's 22SOI high performance technology will be presented. Initial results and failure modes using ultra low-k (ULK) dielectric BEOL during the earl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10cec1ca7fd3f2013eaba1c8d3e9401b
https://doi.org/10.1109/ectc.2013.6575602
https://doi.org/10.1109/ectc.2013.6575602