Zobrazeno 1 - 10
of 58
pro vyhledávání: '"John Mucci"'
Autor:
Ekta Bhatia, Jack Lombardi, Soumen Kar, Michael Senatore, Stephen Olson, Tuan Vo, Sandra Schujman, Jakub Nalaskowski, Hunter Frost, John Mucci, Brian Martinick, Pui Yee Hung, Ilyssa Wells, Thomas Murray, Corbet S. Johnson, Aleksandra Biedron, Vidya Kaushik, Dan Campbell, Matthew D. Lahaye, Satyavolu S. Papa Rao
Publikováno v:
IEEE Transactions on Quantum Engineering, Vol 4, Pp 1-8 (2023)
We report on the development and characterization of superconducting damascene tantalum nitride (TaN) nanowires, 100 nm–3 μm wide, with TaN thicknesses varying from 5 to 35 nm, using 193-nm optical lithography and chemical mechanical planarization
Externí odkaz:
https://doaj.org/article/4556c169aa114e52b4d718f3fabcc68c
Autor:
Soumen Kar, Harrison Walker, Archit Shah, Hunter Frost, Stephen Olson, John Mucci, Jakub Nalaskowski, Brian Martinick, Sandra Schujman, Thomas Murray, Corbet S. Johnson, Ilyssa Wells, Ronald Bourque, Stanley Pierce, Ekta Bhatia, Michael C. Hamilton, Satyavolu S. Papa Rao
Publikováno v:
IEEE Transactions on Applied Superconductivity. 33:1-5
Autor:
Christopher L. Panuski, Ian Christen, Momchil Minkov, Cole J. Brabec, Sivan Trajtenberg-Mills, Alexander D. Griffiths, Jonathan J. D. McKendry, Gerald L. Leake, Daniel J. Coleman, Cung Tran, Jeffrey St Louis, John Mucci, Cameron Horvath, Jocelyn N. Westwood-Bachman, Stefan F. Preble, Martin D. Dawson, Michael J. Strain, Michael L. Fanto, Dirk R. Englund
Publikováno v:
Nature Photonics. 16:834-842
Autor:
Ekta Bhatia, Soumen Kar, Jakub Nalaskowski, Tuan Vo, Stephen Olson, Hunter Frost, John Mucci, Brian Martinick, Pui Yee Hung, Ilyssa Wells, Sandra Schujman, Satyavolu S. Papa Rao
We report on the development of a chemical mechanical planarization (CMP) process for thick damascene Ta structures with pattern feature sizes down to 100 nm. This CMP process is the core of the fabrication sequence for scalable superconducting integ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::62279c1b5fb5ff305c1f16ea4b046ac0
http://arxiv.org/abs/2302.07732
http://arxiv.org/abs/2302.07732
Autor:
Christopher Panuski, Ian Christen, Sivan Trajtenberg Mills, Cole Brabec, Momchil Minkov, Alexander Griffiths, Jonathan J.D. McKendry, Gerald Leake, Daniel Coleman, Cung Tran, Jeffrey St Louis, John Mucci, Cameron Horvath, Jocelyn Westwood-Bachman, Stefan Preble, Martin Dawson, Michael Fanto, Michael Strain, Dirk Englund
Publikováno v:
Conference on Lasers and Electro-Optics.
We present inverse-designed arrays of vertically-coupled, high-finesse, wavelength-scale photonic crystal cavities in a commercial foundry. Dynamically controlling each pixel with a high-speed (~100 MHz) µLED display enables efficient spatial light
Autor:
Christopher L. Panuski, Ian Christen, Momchil Minkov, Cole J. Brabec, Sivan Trajtenberg-Mills, Alexander D. Griffiths, Jonathan J. D. McKendry, Gerald L. Leake, Daniel J. Coleman, Cung Tran, Jeffrey St Louis, John Mucci, Cameron Horvath, Jocelyn N. Westwood-Bachman, Stefan F. Preble, Martin D. Dawson, Michael J. Strain, Michael L. Fanto, Dirk R. Englund
Publikováno v:
Nature Photonics. 17:208-208
Autor:
Jeremiah Hebding, Dan Pascual, Corbet Johnson, Phung Nguyen, Matt Smalley, Vladimir Stojanovic, Tuan Vo, Gerald Leake, Michele Moresco, Doug La Tulipe, Douglas D. Coolbaugh, Michael R. Watts, Paul Tariello, Anh Nguyen, Erman Timurdogan, John Mucci, Colin McDonough
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 13:71-76
A fully functional Si photonics and 65-nm complementary metal-oxide semiconductor (CMOS) heterogeneous three-dimensional (3-D) integration is demonstrated for the first time in a 300-mm production environment. Direct oxide wafer bonding was developed
Autor:
Mignot Yann, Phil Friddle, Catherine B. Labelle, Stafan Schmitz, Genevieve Beique, Bhaskar Nagabhirava, John C. Arnold, Changwoo Lee, Peng Wang, Andre Labonte, Michael Goss, Richard D. Yang, John Mucci, Jian Wu, Bassem Hamieh, Nouradine Rassoul
Publikováno v:
SPIE Proceedings.
As feature critical dimension (CD) shrinks towards and beyond the 7nm node, patterning techniques for optical lithography with double and triple exposure will be replaced by EUV patterning. EUV enables process and overlay improvement, as well as a po
Autor:
Kar, Soumen, Weiland, Conan, Zhou, Chenyu, Bhatia, Ekta, Martinick, Brian, Nalaskowski, Jakub, Mucci, John, Olson, Stephen, Hung, Pui Yee, Wells, Ilyssa, Frost, Hunter, Johnson, Corbet S., Murray, Thomas, Kaushik, Vidya, Kirkpatrick, Sean, Chau, Kiet, Walsh, Michael J., Liu, Mingzhao, Papa Rao, Satyavolu S.
Publikováno v:
Journal of Applied Physics; 7/14/2023, Vol. 134 Issue 2, p1-11, 11p
Publikováno v:
Fair Disclosure Wire (Quarterly Earnings Reports). 11/17/2009.