Zobrazeno 1 - 2
of 2
pro vyhledávání: '"John Michael DeLucca"'
Autor:
B.D. Potteiger, John Michael DeLucca, R.L. Shook, Ahmed Amin, Frank A. Baiocchi, John William Osenbach
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 30:23-35
The microstructure and crystal structure of condensation-induced corrosion products, vapor phase induced oxidation products, Cu-Sn intermetallics, and Sn whiskers that formed on electroplated matte Sn on Cu-alloy after exposure 2500 h in a 60 degC/93
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93508d6b92490566319e43889e70c62f
https://doi.org/10.1109/tepm.2006.890637
https://doi.org/10.1109/tepm.2006.890637
Publikováno v:
Journal of Materials Science: Materials in Electronics. 18:283-305
Whisker growth from the solid state has been documented in the public domain for more than 60 years. Unfortunately, a basic understanding upon which a quantitative model, one which would provide a means for predicting whisker growth and risk and ulti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a6c211928bfcca4d56c21ba5e09966d
https://doi.org/10.1007/s10854-006-9030-6
https://doi.org/10.1007/s10854-006-9030-6