Zobrazeno 1 - 10
of 17
pro vyhledávání: '"John M. Cotte"'
Autor:
Chao Wang, Sung-Wook Nam, John M. Cotte, Christopher V. Jahnes, Evan G. Colgan, Robert L. Bruce, Markus Brink, Michael F. Lofaro, Jyotica V. Patel, Lynne M. Gignac, Eric A. Joseph, Satyavolu Papa Rao, Gustavo Stolovitzky, Stanislav Polonsky, Qinghuang Lin
Publikováno v:
Nature Communications, Vol 8, Iss 1, Pp 1-9 (2017)
The wide use of microfluidics for biological analysis demands scalable preparation methods, yet in practice it is very challenging. Here, Wanget al. show a wafer-scale fabrication of nanofluidic chips with single-digit nanometre dimension, which is c
Externí odkaz:
https://doaj.org/article/8dfe6382a6f3435d9401956b405c4b22
Autor:
Christopher V. Jahnes, Markus Brink, Robert L. Bruce, Lynne Gignac, J. Patel, John M. Cotte, Qinghuang Lin, Eric A. Joseph, Satyavolu S. Papa Rao, Sung-Wook Nam, Michael F. Lofaro, Stanislav Polonsky, Gustavo Stolovitzky, Chao Wang, Evan G. Colgan
Publikováno v:
Nature Communications
Nature Communications, Vol 8, Iss 1, Pp 1-9 (2017)
Nature Communications, Vol 8, Iss 1, Pp 1-9 (2017)
Wafer-scale fabrication of complex nanofluidic systems with integrated electronics is essential to realizing ubiquitous, compact, reliable, high-sensitivity and low-cost biomolecular sensors. Here we report a scalable fabrication strategy capable of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c69acb82cf00396543922f43ad72d2ba
https://doi.org/10.1038/ncomms14243
https://doi.org/10.1038/ncomms14243
Publikováno v:
Journal of The Electrochemical Society. 161:D697-D703
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0469b167d074ce295b56ef040df5e588
https://doi.org/10.1149/2.0851412jes
https://doi.org/10.1149/2.0851412jes
Autor:
Hua Gan, Edmund J. Sprogis, Robert J. Polastre, John M. Cotte, P.S. Andry, Chirag S. Patel, Leena Paivikki Buchwalter, Steven L. Wright, Cornelia K. Tsang, John U. Knickerbocker, R. Horton
Publikováno v:
IEEE Journal of Solid-State Circuits. 41:1718-1725
System-on-Chip (SOC) and System-on-Package (SOP) technologies each have advantages depending on application needs. As system architects and designers leverage ever-increasing CMOS technology densities, a range of two- and three-dimensional silicon in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62a455066a6fc855c47bbb60833023ca
https://doi.org/10.1109/jssc.2006.877252
https://doi.org/10.1109/jssc.2006.877252
Autor:
M. Guillorn, Deqiang Wang, Steve Rossnagel, Lynne Gignac, Qinghuang Lin, Sung-Wook Nam, Ajay K. Royyuru, Robert L. Bruce, Gustavo Stolovitzky, P. J. Litwinowicz, Armand Galan, Dirk Pfeiffer, Evan G. Colgan, Ronald D. Goldblatt, S. Papa Rao, J.J. Bucchignano, Markus Brink, Michael F. Lofaro, Chao Wang, W. H. Advocate, Elizabeth A. Duch, E. Kratschmer, C. M. Breslin, John M. Cotte, William Henry Price, Christopher V. Jahnes, Stas Polonsky, Hongbo Peng, Eric A. Joseph
Publikováno v:
2013 IEEE International Electron Devices Meeting.
We report sub-20 nm sacrificial nanochannels that enable stretching and translocating single DNA molecules. Sacrificial silicon nano-structures were etched with XeF2 to form nanochannels. Translocations of linearized DNA single molecules were imaged
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7009e4a7a92742f8a8752e24815c32d7
https://doi.org/10.1109/iedm.2013.6724627
https://doi.org/10.1109/iedm.2013.6724627
Autor:
Timothy J. Chainer, J. Horkans, Inna V. Babich, Lubomyr T. Romankiw, Philip L. Trouilloud, Emanuel I. Cooper, Nancy C. LaBianca, James A. Tornello, Christopher V. Jahnes, Suryanarayan G. Hegde, Keith T. Kwietniak, Sol Krongelb, Eugene J. O'Sullivan, John M. Cotte
Publikováno v:
IBM Journal of Research and Development. 42:681-694
The use of lithography and electroplating to fabricate variable-reluctance, nearly planar, integrated minimotors with 6-mm-diameter rotors on silicon wafers is described. The motors consist of six electroplated Permalloy® horseshoe-shaped cores that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af4c4c0b61f2f97d15dacdbb172f2949
https://doi.org/10.1147/rd.425.0681
https://doi.org/10.1147/rd.425.0681
Autor:
Christopher M. Molella, Jochonia Nxumalo, Jun Liu, John M. Cotte, George G. Totir, Lukasz J. Hupka, Laura L. Kosbar, Jakub Nalaskowski, Marinus Hopstaken, Kathryn C. Fisher
Publikováno v:
2010 35th IEEE Photovoltaic Specialists Conference.
Scanning capacitance microscopy (SCM) has been used to generate two dimensional images of emitters formed using various doping techniques on polished and textured silicon photovoltaic cells. SCM has the advantage of high spatial resolution and sensit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fdcd4d76677c4ccafbf7e078b3de857
https://doi.org/10.1109/pvsc.2010.5616136
https://doi.org/10.1109/pvsc.2010.5616136
Publikováno v:
Optical Microlithography XXI.
As the Rayleigh equations already tell us, improvements in imaging resolution often come at the price of a depth-offocus loss. Often we balance the resolution versus DoF dilemma without regard of the imaging layers location in the overall film stack.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7974ef8eb400cf7fb39d1626202c5e0
https://doi.org/10.1117/12.773382
https://doi.org/10.1117/12.773382
Autor:
John H. Magerlein, Christopher V. Jahnes, Duixian Liu, Brian P. Gaucher, N. Hoivik, John U. Knickerbocker, Janusz Grzyb, Chirag S. Patel, Ullrich R. Pfeiffer, John M. Cotte, Cornelia K. Tsang
Publikováno v:
2007 IEEE Antennas and Propagation Society International Symposium.
In this paper, a miniature, multi-functional Si-based packaging technology which can reduce the size and cost and increase the performance of a wide range of millimeter wave systems is proposed. High density capacitors, low temperature coefficient re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed0f1e59b2a9236354a4a13a94bb53b2
https://doi.org/10.1109/aps.2007.4396679
https://doi.org/10.1109/aps.2007.4396679
Autor:
Eva E. Simonyi, Hariklia Deligianni, Anna W. Topol, I. Shao, John M. Cotte, Cyril Cabral, Balasubramanian S. Pranatharthi Haran
Publikováno v:
2007 IEEE International Interconnect Technology Conferencee.
This paper addresses a critical CMOS challenge of increasing parasitic resistance by introducing electroplated rhodium (Rh) as an alternative middle-of-line (MOL) metallurgy to replace the conventional CVD tungsten (W) processes for lower contact res
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5661149d13f8af7c0be7c66b544c4c9f
https://doi.org/10.1109/iitc.2007.382360
https://doi.org/10.1109/iitc.2007.382360