Zobrazeno 1 - 10
of 10
pro vyhledávání: '"John L. Jarvis"'
Autor:
Thomas D. Moore, John L. Jarvis
Publikováno v:
Journal of Electronic Packaging. 126:106-109
The peeling stress near the free edge of a bimaterial beam under uniform temperature change creates a moment which causes both layers to have identical curvatures at the interface. A new formula from beam theory is given for this Peeling Moment. A be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f40a3c4456628ba51eb0b7cba44cdbb2
https://doi.org/10.1115/1.1649240
https://doi.org/10.1115/1.1649240
Autor:
John L. Jarvis, Thomas D. Moore
Publikováno v:
Microelectronics Reliability. 43:487-494
The determination of the peeling stress in the interface between the two layers of a bimaterial structure has long been of particular interest in the microelectronic industry. This is because peeling of deposited layers on silicon wafers, and delamin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a8a9b14431a3e9bd1b1b011148bf850
https://doi.org/10.1016/s0026-2714(02)00317-7
https://doi.org/10.1016/s0026-2714(02)00317-7
Autor:
John L. Jarvis, Thomas D. Moore
Publikováno v:
Microelectronics Reliability. 43:155-162
This paper examines thermomechanical warpage in a bimaterial plate. It considers the suitability of axisymmetric and generalized plane strain finite element analyses, and it compares these to the 3-D analysis of a bimaterial plate in which properties
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f362d1a58119892088a369ec025d54ed
https://doi.org/10.1016/s0026-2714(02)00123-3
https://doi.org/10.1016/s0026-2714(02)00123-3
Autor:
John L. Jarvis, Thomas D. Moore
Publikováno v:
Microelectronics Reliability. 42:943-949
It has long been recognized that the properties of printed circuit boards and BGA laminates in the out-of-substrate direction differ greatly from the properties in the plane of the substrate. In this paper the variation of in-substrate-plane properti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc7eb37b2020faff91164621f174e8de
https://doi.org/10.1016/s0026-2714(02)00010-0
https://doi.org/10.1016/s0026-2714(02)00010-0
Autor:
John L. Jarvis, Thomas D. Moore
Publikováno v:
Microelectronics Reliability. 41:461-469
The subject of this paper is a 14×22 mm ball grid array (BGA) integrated circuit assembly containing two or three chips. Three failure modes came to light in the reliability testing of this BGA package: delamination of solder resist from the top cop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4197b6d831206b8f698fc69fd483b127
https://doi.org/10.1016/s0026-2714(00)00230-4
https://doi.org/10.1016/s0026-2714(00)00230-4
Autor:
John L. Jarvis, Simon D. Campion
Publikováno v:
Finite Elements in Analysis and Design. 23:1-21
The use of the p -version finite element method has become more widespread over the last five years or so, as witnessed by the addition of p -elements to a number of well-known commercial codes. A review of the keynote papers on the p -version method
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d7ed998cd6840176abcbdcd97adbcc0
https://doi.org/10.1016/0168-874x(96)00011-x
https://doi.org/10.1016/0168-874x(96)00011-x
Autor:
Thomas D. Moore, John L. Jarvis
Publikováno v:
Journal of Applied Mechanics. 71:290-292
Two-layer beams (i.e., bimaterials) under thermomechanical stress are prone to peeling or delamination at the free edges. The self-equilibrating peeling stress gives rise to a peeling moment Mp close to the free ends. A simple and exact formula for M
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14be3a6c821164f9e672d8db5f875c04
https://doi.org/10.1115/1.1651092
https://doi.org/10.1115/1.1651092
Publikováno v:
7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
A little-used first principles solution was proposed by Hess in 1969 for the stress fields in a bimaterial elastic beam under any arbitrary self equilibrating free end loading. In this paper Hess's solution is implemented using Matlab to calculate ax
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aebd07f23a35d285571865ac50d7a3a7
https://doi.org/10.1109/esime.2006.1644036
https://doi.org/10.1109/esime.2006.1644036
Autor:
John L. Jarvis, Simon D. Campion
Publikováno v:
ASME 1995 15th International Computers in Engineering Conference and the ASME 1995 9th Annual Engineering Database Symposium.
The use of the p-version finite element method has become more widespread over the last five years or so, as witnessed by the addition of p-elements to a number of well known commercial codes. A review of the keynote papers on the p-version method is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ecf93fe31d9bbff4f2b28d9cd40fbf4c
https://doi.org/10.1115/cie1995-0748
https://doi.org/10.1115/cie1995-0748
Autor:
Thomas D. Moore, John L. Jarvis
Publikováno v:
Microelectronics Reliability. 43:1169
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64d117d80a0ad95f52c5ed6cbcef987f
https://doi.org/10.1016/s0026-2714(03)00116-1
https://doi.org/10.1016/s0026-2714(03)00116-1