Zobrazeno 1 - 10
of 425
pro vyhledávání: '"John H Lau"'
Autor:
John H. Lau
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:399-425
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::502d878f9bff8a258d4eafc451e68108
https://doi.org/10.1109/tcpmt.2023.3265529
https://doi.org/10.1109/tcpmt.2023.3265529
Autor:
Tzu-Nien Lee, John-H Lau, Cheng-Ta Ko, Tim Xia, Eagle Lin, Kai-Ming Yang, Puru-Bruce Lin, Chia-Yu Peng, Leo Chang, Jia-Shiang Chen, Yi-Hsiu Fang, Li-Yueh Liao, Edward Charn, Jason Wang, Tzyy-Jang Tseng
Publikováno v:
Materials, Vol 15, Iss 7, p 2396 (2022)
In this study, the Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) of the low-loss dielectric material from three different vendors are measured by the Fabry–Perot open resonator (FPOR) technique. Emphasis is pl
Externí odkaz:
https://doaj.org/article/a7325ed4b3bb49e9871dd6caee5ba862
Autor:
John H. Lau
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:3-25
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::209a723ca32be113f8bc9627e6dc96dc
https://doi.org/10.1109/tcpmt.2023.3234007
https://doi.org/10.1109/tcpmt.2023.3234007
Autor:
John H. Lau
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1271-1281
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::103f9225a69c7b2828e505dfd7231b05
https://doi.org/10.1109/tcpmt.2022.3194374
https://doi.org/10.1109/tcpmt.2022.3194374
Autor:
John H Lau
Publikováno v:
IMAPSource Proceedings. 2022
The state-of-the-art and outlooks for 2.3D IC integration will be investigated in this study. Emphasis is placed on the design, materials, process, advantages and disadvantages, challenges (opportunities), and examples of 2.3D IC integration for chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d683b691b5bfe7f4238a080aaa805855
https://doi.org/10.4071/001c.74588
https://doi.org/10.4071/001c.74588
Autor:
Channing Cheng-Lin Yang, John H Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Andy Peng, Hsing-Ning Liu, YH Chen, Tzyy-Jang Tseng
Publikováno v:
IMAPSource Proceedings. 2022
The design, materials, process, and fabrication of a hybrid substrate for the heterogeneous integration of chips with 50μm-pitch (minimum) by fan-out chip-last panel-level packaging are presented. The hybrid substrate consists of a fine metal linewi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e61cf6b1ecb5c3a8f8a3124d37cfe2f0
https://doi.org/10.4071/001c.74589
https://doi.org/10.4071/001c.74589
Autor:
Tony Chia-Yu Peng, John H. Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Kai-Ming Yang, Bruce Puru Lin, Tim Xia, Leo Chang, Hsing-Ning Liu, Curry Lin, Tzu Nien Lee, Jason Wong, Mike Ma, Tzyy-Jang Tseng
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:469-478
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef1462fe60f93e69f4abb75639bcedb3
https://doi.org/10.1109/tcpmt.2022.3151848
https://doi.org/10.1109/tcpmt.2022.3151848
Autor:
John H. Lau
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:228-252
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3d582848d07f48a446796bdc73fe135
https://doi.org/10.1109/tcpmt.2022.3144461
https://doi.org/10.1109/tcpmt.2022.3144461
Autor:
John H. Lau
Publikováno v:
Chiplet Design and Heterogeneous Integration Packaging ISBN: 9789811999161
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a35af995c1d789a37acc9c7cc4b3be36
https://doi.org/10.1007/978-981-19-9917-8_4
https://doi.org/10.1007/978-981-19-9917-8_4
Autor:
John H. Lau
Publikováno v:
Chiplet Design and Heterogeneous Integration Packaging ISBN: 9789811999161
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25d215e978ec55e54dc6d16dc5cf8ddb
https://doi.org/10.1007/978-981-19-9917-8_1
https://doi.org/10.1007/978-981-19-9917-8_1